SCDS454 January 2024 TMUX7208M
PRODUCTION DATA
Refer to the PDF data sheet for device specific package drawings
THERMAL METRIC(1) | TMUX7208M | UNIT | |
---|---|---|---|
PW (TSSOP) | |||
16 PINS | |||
RθJA | Junction-to-ambient thermal resistance | 93.5 |
°C/W |
RθJC(top) | Junction-to-case (top) thermal resistance | 24.9 |
°C/W |
RθJB | Junction-to-board thermal resistance | 40.0 |
°C/W |
ΨJT | Junction-to-top characterization parameter | 1.0 |
°C/W |
ΨJB | Junction-to-board characterization parameter | 39.4 |
°C/W |
RθJC(bot) | Junction-to-case (bottom) thermal resistance | N/A | °C/W |