SCDS456 January   2024 TMUX7212M

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison Table
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Thermal Information
    4. 6.4 Recommended Operating Conditions
    5. 6.5 Source or Drain Continuous Current
    6.     ±15 V Dual Supply: Electrical Characteristics 
    7.     ±15 V Dual Supply: Switching Characteristics 
    8.     ±20 V Dual Supply: Electrical Characteristics
    9.     ±20 V Dual Supply: Switching Characteristics
    10. 44  V Single Supply: Electrical Characteristics 
    11. 44  V Single Supply: Switching Characteristics 
    12. 12  V Single Supply: Electrical Characteristics 
    13. 12  V Single Supply: Switching Characteristics 
    14. 6.6 Typical Characteristics
  8. 7 Parameter Measurement Information
    1. 7.1  On-Resistance
    2. 7.2  Off-Leakage Current
    3. 7.3  On-Leakage Current
    4. 7.4  tON and tOFF Time
    5. 7.5  tON (VDD) Time
    6. 7.6  Propagation Delay
    7. 7.7  Charge Injection
    8. 7.8  Off Isolation
    9. 7.9  Channel-to-Channel Crosstalk
    10. 7.10 Bandwidth
    11. 7.11 THD + Noise
    12. 7.12 Power Supply Rejection Ratio (PSRR)
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Bidirectional Operation
      2. 8.3.2 Rail-to-Rail Operation
      3. 8.3.3 1.8V Logic Compatible Inputs
      4. 8.3.4 Integrated Pull-Down Resistor on Logic Pins
      5. 8.3.5 Fail-Safe Logic
      6. 8.3.6 Latch-Up Immune
      7. 8.3.7 Ultra-Low Charge Injection
    4. 8.4 Device Functional Modes
    5. 8.5 Truth Tables
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application – Switched Gain Amplifier
    3. 9.3 Design Requirements
    4. 9.4 Detailed Design Procedure
    5. 9.5 Power Supply Recommendations
    6. 9.6 Layout
      1. 9.6.1 Layout Guidelines
      2. 9.6.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • PW|16
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.9 Channel-to-Channel Crosstalk

Crosstalk is defined as the ratio of the signal at the drain pin (Dx) of a different channel, when a signal is applied at the source pin (Sx) of an on-channel. The characteristic impedance, Z0, for the measurement is 50 Ω. Figure 7-9 shows the setup used to measure, and the equation used to compute crosstalk.

GUID-20201203-CA0I-JFRR-XXTS-QXHW6FR9K7XS-low.gif Figure 7-9 Channel-to-Channel Crosstalk Measurement Setup