SLOS275E January   2000  – November 2016 TPA0211

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics - 3 V
    6. 7.6 Electrical Characteristics - 5 V
    7. 7.7 Dissipation Ratings
    8. 7.8 Typical Characteristics
  8. 8 Parameter Measurement Information
    1. 8.1 Set-Up for Graphs
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Bridged-Tied Load Versus Single-Ended Mode
      2. 9.3.2 Single-Ended Operation
      3. 9.3.3 BTL Amplifier Efficiency
      4. 9.3.4 Gain Setting Via Input Resistance
      5. 9.3.5 Crest Factor
    4. 9.4 Device Functional Modes
      1. 9.4.1 Shutdown Mode
      2. 9.4.2 SE/BTL (Stereo/Mono) Operation
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
        1. 10.2.2.1 Surface Mount Capacitor
        2. 10.2.2.2 Input Capacitor, Ci
        3. 10.2.2.3 Power Supply Decoupling, C(S)
        4. 10.2.2.4 Midrail Bypass Capacitor, C(BYP)
        5. 10.2.2.5 Output Coupling Capacitor, C(C)
      3. 10.2.3 Application Curves
  11. 11Power Supply Recommendations
    1. 11.1 Power Supply Decoupling Capacitors
  12. 12Layout
    1. 12.1 Layout Guidelines
      1. 12.1.1 Component Placement
    2. 12.2 Layout Example
    3. 12.3 Thermal Considerations
  13. 13Device and Documentation Support
    1. 13.1 Documentation Support
      1. 13.1.1 Related Documentation
    2. 13.2 Receiving Notification of Documentation Updates
    3. 13.3 Community Resources
    4. 13.4 Trademarks
    5. 13.5 Electrostatic Discharge Caution
    6. 13.6 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DGN|8
Thermal pad, mechanical data (Package|Pins)
Orderable Information

14 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation.