SLOS474E August   2005  – March 2016 TPA2005D1-Q1

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Operating Characteristics
    7. 7.7 Typical Characteristics
  8. 8 Parameter Measurement Information
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Fully Differential Amplifier
        1. 9.3.1.1 Advantages Of Fully Differential Amplifiers
      2. 9.3.2 Efficiency and Thermal Information
      3. 9.3.3 Eliminating the Output Filter With the TPA2005D1-Q1
        1. 9.3.3.1 Effect On Audio
        2. 9.3.3.2 Traditional Class-D Modulation Scheme
        3. 9.3.3.3 TPA2005D1-Q1 Modulation Scheme
        4. 9.3.3.4 Efficiency: Why You Must Use a Filter With The Traditional Class-D Modulation Scheme
        5. 9.3.3.5 Effects Of Applying a Square Wave Into a Speaker
        6. 9.3.3.6 When to Use an Output Filter
    4. 9.4 Device Functional Modes
      1. 9.4.1 Summing Input Signals With the TPA2005D1-Q1
        1. 9.4.1.1 Summing Two Differential Input Signals
        2. 9.4.1.2 Summing A Differential Input Signal And A Single-Ended Input Signal
        3. 9.4.1.3 Summing Two Single-Ended Input Signals
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 TPA2005D1-Q1 With Differential Input
        1. 10.2.1.1 Design Requirements
        2. 10.2.1.2 Detailed Design Procedure
          1. 10.2.1.2.1 Component Selection
          2. 10.2.1.2.2 Input Resistors (RI)
          3. 10.2.1.2.3 Decoupling Capacitor (CS)
        3. 10.2.1.3 Application Curve
      2. 10.2.2 TPA2005D1-Q1 With Differential Input and Input Capacitors
        1. 10.2.2.1 Detailed Design Requirements
          1. 10.2.2.1.1 Input Capacitors (CI)
      3. 10.2.3 TPA2005D1-Q1 With Single-Ended Input
  11. 11Power Supply Recommendations
    1. 11.1 Power Supply Decoupling Capacitors
  12. 12Layout
    1. 12.1 Layout Guidelines
      1. 12.1.1 Component Location
      2. 12.1.2 Trace Width
      3. 12.1.3 8-Pin QFN (DRB) Layout
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Documentation Support
      1. 13.1.1 Related Documentation
    2. 13.2 Community Resource
    3. 13.3 Trademarks
    4. 13.4 Electrostatic Discharge Caution
    5. 13.5 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

13 Device and Documentation Support

13.1 Documentation Support

13.1.1 Related Documentation

For related documentation see the following:

  • AN-1737 Managing EMI in Class D Audio Applications, SNAA050
  • AN-1849 An Audio Amplifier Power Supply Design, SNAA057
  • Guidelines for Measuring Audio Power Amplifier Performance, SLOA068
  • Measuring Class-D Amplifiers for Audio Speaker Overstress Testing, SLOA116
  • Power Rating in Audio Amplifiers, SLEA047
  • TPA2005D1 Audio Power Amplifier Evaluation Module, SLOU134

13.2 Community Resource

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

    TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
    Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.

13.3 Trademarks

PowerPAD, E2E are trademarks of Texas Instruments.

All other trademarks are the property of their respective owners.

13.4 Electrostatic Discharge Caution

esds-image

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.

13.5 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.