SLOS438F December   2004  – March 2017 TPA2012D2

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Dissipation Rating Table
    7. 7.7 Typical Characteristics
  8. 8 Parameter Measurement Information
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Fixed Gain Setting
      2. 9.3.2 Short-Circuit Protection
      3. 9.3.3 Operation With DACs and CODECs
      4. 9.3.4 Filter-Free Operation and Ferrite Bead Filters
    4. 9.4 Device Functional Modes
      1. 9.4.1 Shutdown Mode
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Applications
      1. 10.2.1 TPA2012D2 With Differential Input Signal
        1. 10.2.1.1 Design Requirements
        2. 10.2.1.2 Detailed Design Procedure
          1. 10.2.1.2.1 Surface Mount Capacitors
          2. 10.2.1.2.2 Decoupling Capacitor (CS)
          3. 10.2.1.2.3 Input Capacitors (CI)
        3. 10.2.1.3 Application Curves
      2. 10.2.2 TPA2012D2 With Single-Ended Input Signal
        1. 10.2.2.1 Design Requirements
        2. 10.2.2.2 Detailed Design Procedure
        3. 10.2.2.3 Application Curves
  11. 11Power Supply Recommendations
    1. 11.1 Power Supply Decoupling Capacitor
  12. 12Layout
    1. 12.1 Layout Guidelines
      1. 12.1.1 Pad Side
      2. 12.1.2 Component Location
      3. 12.1.3 Trace Width
    2. 12.2 Layout Examples
    3. 12.3 Efficiency and Thermal Considerations
  13. 13Device and Documentation Support
    1. 13.1 Receiving Notification of Documentation Updates
    2. 13.2 Community Resources
    3. 13.3 Trademarks
    4. 13.4 Electrostatic Discharge Caution
    5. 13.5 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

1 Features

  • Output Power By Package:
    • WQFN:
      • 2.1 W/Ch Into 4 Ω at 5 V
      • 1.4 W/Ch Into 8 Ω at 5 V
      • 720 mW/Ch Into 8 Ω at 3.6 V
    • DSBGA:
      • 1.2 W/Ch Into 4 Ω at 5 V
        (Thermally Limited)
      • 1.3 W/Ch Into 8 Ω at 5 V
      • 720 mW/Ch Into 8 Ω at 3.6 V
  • Only Two External Components Required
  • Power Supply Range: 2.5 V to 5.5 V
  • Independent Shutdown Control for Each Channel
  • Selectable Gain of 6, 12, 18, and 24 dB
  • Internal Pulldown Resistor on Shutdown Pins
  • High PSRR: 77 dB at 217 Hz
  • Fast Start-Up Time (3.5 ms)
  • Low Supply Current
  • Low Shutdown Current
  • Short-Circuit and Thermal Protection
  • Space-Saving Packages
    • 2.01-mm × 2.01-mm NanoFree™ DSBGA (YZH)
    • 4-mm × 4-mm Thin WQFN (RTJ) With PowerPAD™

2 Applications

  • Wireless or Cellular Handsets and PDAs
  • Portable DVD Players
  • Notebook PCs
  • Portable Radios
  • Portable Gaming
  • Educational Toys
  • USB Speakers

3 Description

The TPA2012D2 is a stereo, filter-free, Class-D audio amplifier (Class-D amp) available in a DSBGA or WQFN package. The TPA2012D2 only requires two external components for operation.

The TPA2012D2 features independent shutdown controls for each channel. The gain can be selected to 6, 12, 18, or 24 dB using the G0 and G1 gain select pins. High PSRR and differential architecture provide increased immunity to noise and RF rectification. In addition to these features, a fast start-up time and small package size make the TPA2012D2 class-D amp an ideal choice for both cellular handsets and PDAs.

The TPA2012D2 is capable of driving 1.4 W/Ch at
5 V or 720 mW/Ch at 3.6 V into 8 Ω. The TPA2012D2 is also capable of driving 4 Ω. The TPA2012D2 is thermally limited in DSBGA and may not achieve
2.1 W/Ch for 4 Ω. The maximum output power in the DSBGA is determined by the ability of the circuit board to remove heat. Figure 33 shows thermally limited region of the DSBGA in relation to the WQFN package. The TPA2012D2 provides thermal and short-circuit protection.

Device Information(1)

PART NUMBER PACKAGE BODY SIZE (NOM)
TPA2012D2 DSBGA (16) 2.01 mm × 2.01 mm
WQFN (20) 4.00 mm × 4.00 mm
  1. For all available packages, see the orderable addendum at the end of the data sheet.

Simplified Application Schematic

TPA2012D2 appl_cir_los438.gif

4 Revision History

Changes from E Revision (September 2016) to F Revision

  • Switched the BODY SIZE values in the Device Information table: DSBGA From: 4.00 mm × 4.00 mm To: 2.01 mm × 2.01 mm and WQFN From: 2.01 mm × 2.01 mm To: 4.00 mm × 4.00 mmGo

Changes from D Revision (June 2008) to E Revision

  • Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information sectionGo
  • Deleted Available-Options table; see POA at the end of the data sheetGo
  • Deleted previous application schematics: Typical Application Circuit (previously Figure 33), TPA2012D2 Application Schematic With Differential Input and Input Capacitors (previously Figure 34), and TPA2012D2 Application Schematic With Single-Ended Input (previously Figure 35)Go