SLOS367E August   2003  – November 2015 TPA6211A1

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operation Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Operating Characteristics
    7. 7.7 Dissipation Ratings
    8. 7.8 Typical Characteristics
  8. 8 Parameter Measurement Information
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Fully Differential Amplifier Efficiency and Thermal Information
        1. 9.3.1.1 Advantages of Fully Differential Amplifiers
        2. 9.3.1.2 Differential Output Versus Single-Ended Output
    4. 9.4 Device Functional Modes
      1. 9.4.1 Shutdown Mode
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
        1. 10.2.2.1 Selecting Components
          1. 10.2.2.1.1 Resistors (RI)
          2. 10.2.2.1.2 Bypass Capacitor (CBYPASS) and Start-Up Time
          3. 10.2.2.1.3 Input Capacitor (CI)
          4. 10.2.2.1.4 Band-Pass Filter (Ra, Ca, and Ca)
            1. 10.2.2.1.4.1 Step 1: Low-Pass Filter
            2. 10.2.2.1.4.2 Step 2: High-Pass Filter
            3. 10.2.2.1.4.3 Step 3: Additional Low-Pass Filter
          5. 10.2.2.1.5 Decoupling Capacitor (CS)
          6. 10.2.2.1.6 Using Low-ESR Capacitors
      3. 10.2.3 Application Curves
    3. 10.3 System Examples
  11. 11Power Supply Recommendations
    1. 11.1 Power Supply Decoupling Capacitor
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Examples
  13. 13Device and Documentation Support
    1. 13.1 Device Support
      1. 13.1.1 Development Support
    2. 13.2 Documentation Support
      1. 13.2.1 Related Documentation
    3. 13.3 Community Resources
    4. 13.4 Trademarks
    5. 13.5 Electrostatic Discharge Caution
    6. 13.6 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DGN|8
  • DRB|8
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6 Pin Configuration and Functions

DGN Package
8-Pin MSOP-PowerPAD
Top View
TPA6211A1 po_msop_slos367.gif
DRB Package
8-Pin SON With Exposed Thermal Pad
Top View
TPA6211A1 po_son_slos367.gif

Pin Functions

PIN I/O DESCRIPTION
NAME NO.
BYPASS 2 – Mid-supply voltage, adding a bypass capacitor improves PSRR
GND 7 I High-current ground
IN+ 3 I Positive differential input
IN- 4 I Negative differential input
SHUTDOWN 1 I Shutdown terminal (active low logic)
VDD 6 I Power supply
VO+ 5 O Positive BTL output
VO- 8 O Negative BTL output
Thermal Pad – – Connect to ground. Thermal pad must be soldered down in all applications to properly secure device on the PCB.