SLVSBC5D March 2012 – October 2015 TPD13S523
PRODUCTION DATA.
MIN | MAX | UNIT | ||
---|---|---|---|---|
VCC voltage tolerance | 5V_SUPPLY | –0.3 | 6 | V |
IO voltage tolerance | Connector pins(2) | –0.3 | 6 | V |
IEC 61000-4-5 peak current (8/20 µs) | Connector pins(2) | 3 | A | |
IEC 61000-4-5 peak power (8/20 µs) | Connector pins(2) | 30 | W | |
Storage temperature, Tstg | –65 | 125 | °C |
VALUE | UNIT | |||
---|---|---|---|---|
V(ESD) | Electrostatic discharge | Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) | ±2000 | V |
Charged device model (CDM), per JEDEC specification JESD22-C101(2) | ±500 | |||
IEC 61000-4-2 Contact Discharge | ±12000 | |||
IEC 61000-4-2 Air-gap Discharge | ±14000 |
MIN | MAX | UNIT | ||
---|---|---|---|---|
VCC Voltage | 5V_SUPPLY | 4.5 | 5.5 | V |
IO voltage at external signal pins | Signal Pins(1) | –0.3 | 5.5 | V |
Operating free-air temperature | –40 | 85 | °C |
THERMAL METRIC(1) | TPD13S523 | UNIT | ||
---|---|---|---|---|
PW [TSSOP] | RSV [UQFN] | |||
16 PINS | 16 PINS | |||
RθJA | Junction-to-ambient thermal resistance | 119.9 | 153.2 | °C/W |
RθJC(top) | Junction-to-case (top) thermal resistance | 54.5 | 70.9 | °C/W |
RθJB | Junction-to-board thermal resistance | 65.0 | 74.7 | °C/W |
ψJT | Junction-to-top characterization parameter | 9.7 | 2.9 | °C/W |
ψJB | Junction-to-board characterization parameter | n/a | 74.7 | °C/W |
RθJC(bot) | Junction-to-case (bottom) thermal resistance | n/a | n/a | °C/W |
PARAMETER | TEST CONDITIONS | MIN | TYP | MAX | UNIT | |
---|---|---|---|---|---|---|
LOAD SWITCH | ||||||
ICC | Supply current at 5V_SUPPLY | 5V_SUPPLY =5V, 5V OUT = Open | 6.5 | 7 | 10 | µA |
ISC | Short-circuit current at 5V_OUT | 5V_SUPPLY =5V, 5V_OUT = GND | 100 | 116 | 147 | mA |
IBACKDRIVE | Reverse leakage current at 5VOUT | 5V_SUPPLY =0V, 5V_OUT = 5 V | 0.01 | 0.69 | µA | |
VDROP | 5V_OUT output voltage drop | 5V_SUPPLY =5V, I5V_OUT = 55 mA | 170 | 205 | mV | |
CONNECTOR PINS | ||||||
VRWM | Reverse stand-off voltage | 5.5 | V | |||
VCLAMP | Clamp voltage with ESD strike | Ipp = 1 A, 8/20 μs(1) | 13 | V | ||
Ipp = 3 A, 8/20 μs(1) | 15 | |||||
IIO | Leakage current through external signal pins(3) | 5V_SUPPLY =5V, VIO = 5 V | 2 | 7 | 65 | nA |
IOFF | Current from IO Port to supply pins when powered down through signal pins(2) | 5V_SUPPLY = 0 V, VIO = 2.5 V | 1 | 5 | 44 | nA |
VF | Diode forward voltage through external signal pins(3); lower clamp diode | ID = 8 mA | 0.7 | 0.85 | 0.95 | V |
RDYN | Dynamic resistance of ESD clamps external pins(2) | Pin to ground(3) | 0.5 | Ω | ||
CIO_TMDS | IO capacitance Dx+, Dx– pins to GND | 5V_SUPPLY = 5 V, VIO = 2.5 V; ƒ = 1 MHz |
1 | pF | ||
ΔCIO_TMDS | Differential capacitance for the Dx+, Dx– lines | 5V_SUPPLY = 5 V, VIO = 2.5 V; ƒ = 1 MHz |
0.05 | pF | ||
CIO_CONTROL | CTRLx pin capacitance | 5V_SUPPLY = 5 V, VIO = 2.5 V; ƒ = 1 MHz |
1 | pF | ||
VBR | Break-down voltage through signal pins(2) | IIO = 1 mA | 6 | V |
CIN = 1 µF | COUT = 1µF | ISWITCH = 55 mA |
TA = 25°C |
5V_SUPPLY = 5 V | 5V_OUT = Open |