SLLSEB1G February   2012  – August 2024 TPD1E10B06

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings - JEDEC Specification
    3. 5.3 ESD Ratings—IEC Specification
    4. 5.4 Recommended Operating Conditions
    5. 5.5 Thermal Information
    6. 5.6 Electrical Characteristics
    7. 5.7 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
    4. 6.4 Device Functional Modes
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
      3. 7.2.3 Application Curves
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Receiving Notification of Documentation Updates
    2. 8.2 Support Resources
    3. 8.3 Trademarks
    4. 8.4 Electrostatic Discharge Caution
    5. 8.5 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information
    1. 10.1 Tape and Reel Information
    2. 10.2 Mechanical Data

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

1 Features

  • Provides system-level ESD protection for low-voltage I/O interface
  • IEC 61000-4-2 level 4 ESD protection
    • ±30kV contact discharge
    • ±30kV air-gap discharge
  • IEC 61000-4-5 surge: 6A (8/20µs)
  • I/O capacitance 12pF (typical)
  • RDYN 0.4Ω (typical)
  • DC breakdown voltage ±6V (minimum)
  • Ultralow leakage current 100nA (maximum)
  • 10V clamping voltage (maximum at IPP = 1A)
  • Industrial temperature range: –40°C to 125°C
  • Small 0402 footprint (1mm × 0.6mm × 0.5mm)
  • Industry standard SOD-523 package (0.8mm × 1.2mm)