SLLSEB0E February   2012  – September 2023 TPD1E10B09

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Revision History
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Receiving Notification of Documentation Updates
    2. 9.2 Support Resources
    3. 9.3 Trademarks
    4. 9.4 Electrostatic Discharge Caution
    5. 9.5 Glossary
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from Revision D (August 2015) to Revision E (September 2023)

  • Changed the format of the Package Information table to include package lead sizeGo
  • Changed the numbering format for tables, figures, and cross-references throughout the documentGo

Changes from Revision C (June 2015) to Revision D (August 2015)

  • Added capacitive measurement frequencyGo

Changes from Revision B (October 2012) to Revision C (June 2015)

  • Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information sectionGo
  • Added ESD Ratings tableGo
  • Added Feature Description sectionGo
  • Added Device Functional Modes Go
  • Added Application and Implementation sectionGo
  • Added Power Supply Recommendations sectionGo
  • Added Mechanical, Packaging, and Orderable Information sectionGo

Changes from Revision A (March 2012) to Revision B (October 2012)

  • Added Thermal Information tableGo

Changes from Revision * (February 2012) to Revision A (March 2012)

  • Updated Features sectionGo
  • Added graphs to Typical Characteristics section.Go
  • Added APPLICATION INFORMATION section.Go