SLLSEG9C June   2013  – December  2019 TPD2E2U06

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Simplified Schematic
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 IEC 61000-4-2 Level 4
      2. 7.3.2 IO Capacitance
      3. 7.3.3 DC Breakdown Voltage
      4. 7.3.4 Ultra-Low Leakage Current
      5. 7.3.5 Low ESD Clamping Voltage
      6. 7.3.6 Industrial Temperature Range
      7. 7.3.7 Small Easy-to-Route Package
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Signal Range
        2. 8.2.2.2 Operating Frequency
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Trademarks
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Support Resources
    4. 11.4 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.4 Thermal Information

THERMAL METRIC(1) TPD2E2U06 UNIT
DRL DCK
5 PINS 3 PINS
RθJA Junction-to-ambient thermal resistance 286.8 308.3 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 130.7 170.7
RθJB Junction-to-board thermal resistance 104.8 89.2
ψJT Junction-to-top characterization parameter 25.6 34.2
ψJB Junction-to-board characterization parameter 104.3 88.6
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC package thermal metrics application report.