SLVSAM5A January   2011  – April 2016 TPD3F303

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6  Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 ESD Ratings - Surge Protection
    4. 6.4 Recommended Operating Conditions
    5. 6.5 Thermal Information
    6. 6.6 Electrical Characteristics
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Bidirectional EMI Filtering and Line Termination With Integrated ESD Protection
      2. 7.3.2 IEC 61000-4-2 ESD Protection
      3. 7.3.3 DC Breakdown Voltage
      4. 7.3.4 Low Leakage Current
      5. 7.3.5 Low Noise C-R-C Filter Topology
      6. 7.3.6 Integrated VCC Clamp
      7. 7.3.7 Space-Saving Packages
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Signal Range
        2. 8.2.2.2 Required ESD Protection
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Community Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8 Application and Implementation

NOTE

Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes. Customers should validate and test their design implementation to confirm system functionality.

8.1 Application Information

The TPD3F303 is a diode type TVS + EMI filter which is used to provide a path to ground for dissipating ESD events on signal lines between a SIM card slot and a system. As the current from ESD passes through the TVS, only a small voltage drop is present across the diode. This is the voltage presented to the protected IC across the termination resistors.

8.2 Typical Application

TPD3F303 sim-app-diagram.gif Figure 6. Typical SIM Card Application

8.2.1 Design Requirements

For this design example, one TPD3F303 is used to protect a SIM card interface. Table 1 lists the parameters for Figure 6.

Table 1. Design Parameters

PARAMETER VALUE
Signal Range on Protected Lines 0 V to 5 V
Required Level of IEC ESD Protection ±15-kV Contact, ±15-kV Air Gap

8.2.2 Detailed Design Procedure

To begin the design process, some parameters must be decided upon; the designer must know the following:

  • Voltage range of the signal on all protected lines
  • Required ESD protection needed

8.2.2.1 Signal Range

The TPD3F303 supports signal ranges from 0 V to 5.5 V, which supports the SIM card application

8.2.2.2 Required ESD Protection

The TPD3F303 is rated to withstand up to ±15-kV contact and ±15-kV air gap IEC ESD. This meets the IEC ESD design target.

8.2.3 Application Curves

TPD3F303 pos15_clk_lvsam5.gif Figure 7. +15-kV IEC Contact, DATA1_In Stressed
TPD3F303 pos15_clk_lvsam5.gif Figure 9. +15-kV IEC Contact, CLK_In Stressed
TPD3F303 amplitude_t_lvsam5.gif Figure 8. -15-kV IEC Contact, DATA1_In Stressed
TPD3F303 pos15_clk_lvsam5.gif Figure 10. -15-kV IEC Contact, CLK_In Stressed