SLUSDH1B may   2020  – april 2023 TPD3S713-Q1 , TPD3S713A-Q1

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 FAULT Response
      2. 8.3.2 Cable Compensation
        1. 8.3.2.1 Design Procedure
      3. 8.3.3 DP and DM Protection
      4. 8.3.4 VBUS OVP Protection
      5. 8.3.5 Output and DP or DM Discharge
      6. 8.3.6 Overcurrent Protection
      7. 8.3.7 Undervoltage Lockout
      8. 8.3.8 Thermal Sensing
      9. 8.3.9 Current-Limit Setting
    4. 8.4 Device Functional Modes
      1. 8.4.1 Device Truth Table (TT)
      2. 8.4.2 Client Mode
      3. 8.4.3 High-Bandwidth Data-Line Switch
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Input Capacitance
        2. 9.2.2.2 Output Capacitance
        3. 9.2.2.3 BIAS Capacitance
        4. 9.2.2.4 Output and BIAS TVS
      3. 9.2.3 Application Curves
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  10. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  11. 11Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • RVC|20
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8.3.1 FAULT Response

The device features an active-low, open-drain fault output. FAULT goes low when there is a fault condition. Fault detection includes overtemperature, overcurrent, or overvoltage on VBUS, DP_IN and DM_IN. Connect a 10-kΩ pullup resistor from FAULT to IN.

Table 8-1 summarizes the conditions that generate a fault and actions taken by the device.

Table 8-1 Fault Conditions
EVENTCONDITIONTPD3S713-Q1TPD3S713A-Q1
Overvoltage on the data linesV(DP_IN) or V(DM_IN) > 3.9 VThe device immediately shuts off the USB data switches and the internal power switch. The fault indicator asserts with a 16-ms deglitch, and deasserts without deglitch.The device immediately shuts off the USB data switches, and the internal power switch keeps turn on. The fault indicator asserts with a 16-ms deglitch, and deasserts without deglitch.
Overvoltage on V(BUS)V(BUS) > 6 VThe device immediately shuts off the internal power switch and the USB data switches. The fault indicator asserts with a 16-ms deglitch and deasserts without deglitch.The device immediately shuts off the internal power switch and the USB data switches. The fault indicator asserts with a 16-ms deglitch and deasserts without deglitch.
Overcurrent on V(BUS)I(BUS) > I(OS)The device regulates switch current at I(OS) until thermal cycling occurs. The fault indicator asserts and deasserts with an 8-ms deglitch.The device regulates switch current at I(OS) until thermal cycling occurs. The fault indicator asserts and deasserts with an 8-ms deglitch.
OvertemperatureTJ > OTSD2 in non-current-limited or TJ > OTSD1 in current-limited mode.The device immediately shuts off the internal power switch and the USB data switches. The fault indicator asserts immediately when the junction temperature exceeds OTSD2 or OTSD1 while in a current-limiting condition. The device has a thermal hysteresis of 20°C.The device immediately shuts off the internal power switch and the USB data switches. The fault indicator asserts immediately when the junction temperature exceeds OTSD2 or OTSD1 while in a current-limiting condition. The device has a thermal hysteresis of 20°C.