SLLSEK0A December   2014  – February 2015 TPD6F002-Q1

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Simplified Schematic
  5. 5 Revision History
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 AEC-Q101 Qualified
      2. 8.3.2 Six-Channel EMI Filtering
      3. 8.3.3 Pi-Style Filter Configuration
      4. 8.3.4 Robust ESD Protection
      5. 8.3.5 Low Leakage Current
      6. 8.3.6 Space-Saving SON Package
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Signal Range on All Protected Lines
        2. 9.2.2.2 Operating Frequency
        3. 9.2.2.3 Crosstalk Response
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Trademarks
    2. 12.2 Electrostatic Discharge Caution
    3. 12.3 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6 Pin Configuration and Functions

DSV PACKAGE
(3.0 mm × 1.35 mm × 0.75 mm)
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Pin Functions

PIN I/O DESCRIPTION
NAME NO.
ChX_In 1, 2, 3, 4, 5, 6 IO ESD-protected channel, connected to corresponding ChX_Out
ChX_Out 7, 8, 9, 10, 11, 12 IO ESD-protected channel, connected to corresponding ChX_In
GND G G Ground