SLVSHZ1 June   2024 TPS1HTC100-Q1

PRODUCTION DATA  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Pin Configuration and Functions
    1. 4.1 Recommended Connections for Unused Pins
  6. Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 SNS Timing Characteristics
    7. 5.7 Switching Characteristics
    8. 5.8 Timing Diagrams
    9. 5.9 Typical Characteristics
  7. Parameter Measurement Information
  8. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Accurate Current Sense
      2. 7.3.2 Programmable Current Limit
        1. 7.3.2.1 Capacitive Charging
      3. 7.3.3 Inductive-Load Switching-Off Clamp
      4. 7.3.4 Full Protections and Diagnostics
        1. 7.3.4.1 Short-Circuit and Overload Protection
        2. 7.3.4.2 Open-Load Detection
        3. 7.3.4.3 Thermal Protection Behavior
        4. 7.3.4.4 UVLO Protection
        5. 7.3.4.5 Reverse Polarity Protection
        6. 7.3.4.6 Protection for MCU I/Os
      5. 7.3.5 Diagnostic Enable Function
    4. 7.4 Device Functional Modes
      1. 7.4.1 Device Functional Modes
  9. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Dynamically Changing Current Limit
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
        1. 8.4.2.1 Without a GND Network
        2. 8.4.2.2 With a GND Network
        3. 8.4.2.3 Thermal Considerations
  10. Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Detailed Design Procedure

To keep maximum voltage on the SNS pin at an acceptable range for the system, use the following equation to calculate the RSNS. To achieve better current sense accuracy. A 1% accuracy or better resistor is preferred.

Equation 11. VADC,min × KSNS / ILOAD,min ≤ RSNS ≤ (VSNSFH – VHR) × KSNS / ILOAD,max

Table 8-1 Typical Application

Parameter

Value

VDIAG_EN

5V

ILOAD,max

4A

ILOAD,min

20mA

VADC,min

5mV

VHR

1V

For this application, an RSNS value of approximately 800 Ω can be chosen to satisfy the equation requirements.

Equation 12. 5mV × 800 / 20mA ≤ ≅800 Ω ≤ (5V – 1V) × 800 / 4A

In other applications, where there is a higher dynamic current range either more emphasis can be put on the lower end measurable values which increases RSNS. Likewise, if the higher currents are of more interest the RSNS can be decreased.

Having the maximum SNS voltage scale with the DIAG_EN voltage removes the need for a Zener diode on the SNS pin going to the ADC.

To set the programmable current limit value at 5A, use the following equation to calculate the RLIM.

Equation 13. RLIM = KCL / ILIM = 50 / 5 = 10kΩ

TI recommends RPROT = 10kΩ to ensure the current going into the digital pins (EN, DIAG_EN, LATCH) is limited.

TI recommends a 4.7kΩ resistor and 600V, 0.2A diode for the GND network.