SLVS514P April   2004  – August 2024 TPS2041B , TPS2042B , TPS2043B , TPS2044B , TPS2051B , TPS2052B , TPS2053B , TPS2054B

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 General Switch Catalog
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics (All Devices Excluding TPS2051BDBV and TPS2052BD)
    7. 6.7 Typical Characteristics (TPS2051BDBV and TPS2052BD)
  8. 7 Parameter Measurement Information
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagrams
    3. 8.3 Feature Description
      1. 8.3.1  Power Switch
      2. 8.3.2  Charge Pump
      3. 8.3.3  Driver
      4. 8.3.4  Enable ( ENx)
      5. 8.3.5  Enable (ENx)
      6. 8.3.6  Current Sense
      7. 8.3.7  Overcurrent
        1. 8.3.7.1 Overcurrent Conditions (TPS20x3BD, TPS20x4BD, and TPS20x2BDRB)
        2. 8.3.7.2 Overcurrent Conditions (TPS20x1B & TPS20x2B in D, DGN, and DBV packages)
      8. 8.3.8  Overcurrent ( OCx)
      9. 8.3.9  Thermal Sense
      10. 8.3.10 Undervoltage Lockout
    4. 8.4 Device Functional Modes
  10. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Universal Serial Bus (USB) Applications
    2. 9.2 Typical Application
      1. 9.2.1 Typical Application (TPS2042B)
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
          1. 9.2.1.2.1 Power-Supply Considerations
          2. 9.2.1.2.2 OC Response
        3. 9.2.1.3 Application Curves
      2. 9.2.2 Host and Self-Powered and Bus-Powered Hubs
        1. 9.2.2.1 Design Requirements
          1. 9.2.2.1.1 USB Power-Distribution Requirements
        2. 9.2.2.2 Detailed Design Procedure
          1. 9.2.2.2.1 Low-Power Bus-Powered and High-Power Bus-Powered Functions
        3. 9.2.2.3 Application Curves
      3. 9.2.3 Generic Hot-Plug Applications
        1. 9.2.3.1 Design Requirements
        2. 9.2.3.2 Detailed Design Procedure
        3. 9.2.3.3 Application Curves
  11. 10Power Supply Recommendations
    1. 10.1 Undervoltage Lockout (UVLO)
  12. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
    3. 11.3 Power Dissipation
    4. 11.4 Thermal Protection
  13. 12Device and Documentation Support
    1. 12.1 Receiving Notification of Documentation Updates
    2. 12.2 Support Resources
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  14. 13Revision History
  15. 14Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.4 Thermal Information

THERMAL METRIC(1) D
(SOIC)		 DBV
(SOT-23)		 DGN
(HVSSOP)		 DRB
(SON)		 UNIT
8 PINS 16 PINS 5 PINS 8 PINS 8 PINS
RθJA Junction-to-ambient thermal resistance 119.3 81.6 208.6 53.6 47.5 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 67.6 42.7 122.9 58.7 53 °C/W
RθJB Junction-to-board thermal resistance 59.6 39.1 37.8 35.5 14.2 °C/W
ψJT Junction-to-top characterization parameter 20.3 10.4 14.6 2.7 1.2 °C/W
ψJB Junction-to-board characterization parameter 59.1 38.8 36.9 35.3 14.2 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance N/A N/A N/A 6.7 7.3 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.