SLVS514O April   2004  – June 2024 TPS2041B , TPS2042B , TPS2043B , TPS2044B , TPS2051B , TPS2052B , TPS2053B , TPS2054B

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 General Switch Catalog
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics (All Devices Excluding TPS2051BDBV and TPS2052BD)
    7. 6.7 Typical Characteristics (TPS2051BDBV and TPS2052BD)
  8. 7 Parameter Measurement Information
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagrams
    3. 8.3 Feature Description
      1. 8.3.1  Power Switch
      2. 8.3.2  Charge Pump
      3. 8.3.3  Driver
      4. 8.3.4  Enable ( ENx)
      5. 8.3.5  Enable (ENx)
      6. 8.3.6  Current Sense
      7. 8.3.7  Overcurrent
        1. 8.3.7.1 Overcurrent Conditions (TPS20x3BD, TPS20x4BD, and TPS20x2BDRB)
        2. 8.3.7.2 Overcurrent Conditions (TPS20x1B & TPS20x2B in D, DGN, and DBV packages)
      8. 8.3.8  Overcurrent ( OCx)
      9. 8.3.9  Thermal Sense
      10. 8.3.10 Undervoltage Lockout
    4. 8.4 Device Functional Modes
  10. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Universal Serial Bus (USB) Applications
    2. 9.2 Typical Application
      1. 9.2.1 Typical Application (TPS2042B)
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
          1. 9.2.1.2.1 Power-Supply Considerations
          2. 9.2.1.2.2 OC Response
        3. 9.2.1.3 Application Curves
      2. 9.2.2 Host and Self-Powered and Bus-Powered Hubs
        1. 9.2.2.1 Design Requirements
          1. 9.2.2.1.1 USB Power-Distribution Requirements
        2. 9.2.2.2 Detailed Design Procedure
          1. 9.2.2.2.1 Low-Power Bus-Powered and High-Power Bus-Powered Functions
        3. 9.2.2.3 Application Curves
      3. 9.2.3 Generic Hot-Plug Applications
        1. 9.2.3.1 Design Requirements
        2. 9.2.3.2 Detailed Design Procedure
        3. 9.2.3.3 Application Curves
  11. 10Power Supply Recommendations
    1. 10.1 Undervoltage Lockout (UVLO)
  12. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
    3. 11.3 Power Dissipation
    4. 11.4 Thermal Protection
  13. 12Device and Documentation Support
    1. 12.1 Receiving Notification of Documentation Updates
    2. 12.2 Support Resources
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  14. 13Revision History
  15. 14Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

13 Revision History

Changes from Revision N (July 2023) to Revision O (June 2024)

  • Updated origination date from June 2010 to April 2004 to match initial release of the data sheetGo
  • Deleted Dissipation Ratings tableGo
  • Deleted "TPS2042xx and TPS2053xx" in table titleGo
  • Updated max UVLO and Supply current, high-level output values for the TPS2041BDR, TPS2041BDGNR, TPS2042BDR, TPS2042BDGNR, TPS2051BDR, TPS2051BDGNR, TPS2052BDGNR, and TPS2041BDBVRGo
  • Updated Overcurrent trip threshold to apply only to TPS2042B and TPS2052B (DRB packages only)Go
  • Go
  • Added TPS2051BDBGo
  • Updated Section 8.3.7to show that the TPS20x1B and TPS20x2B devices in the D, DGN, and DBV packages do not have overcurrent trip thresholdsGo
  • Updated Section 8.3.7.1 Go
  • Updated Section 8.3.7.2 Go

Changes from Revision M (June 2016) to Revision N (July 2023)

  • Updated the numbering format for tables, figures, and cross-references throughout the documentGo
  • Update TPS2051BDBV and TPS2052BD electrical characteristics, including overcurrent trip threshold, high-level output supply current and undervoltage lockout.Go

Changes from Revision L (June 2011) to Revision M (June 2016)

  • Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section Go