SLVS490K December   2003  – June 2024 TPS2061 , TPS2062 , TPS2063 , TPS2065 , TPS2066 , TPS2067

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Description (continued)
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 Recommended Operating Conditions
    3. 6.3 Thermal Information
    4. 6.4 Electrical Characteristics
    5. 6.5 Typical Characteristics (TPS2061, TPS2062, TPS2065, and TPS2066)
    6. 6.6 Typical Characteristics (TPS2063 & TPS2067)
  8. 7 Parameter Measurement Information
  9. 8 Detailed Description
    1. 8.1  Functional Block Diagram
    2. 8.2  Power Switch
    3. 8.3  Charge Pump
    4. 8.4  Driver
    5. 8.5  Enable ( ENx or ENx)
    6. 8.6  Current Sense
    7. 8.7  Overcurrent
      1. 8.7.1 Overcurrent Conditions (TPS2063 and TPS2067)
      2. 8.7.2 Overcurrent Conditions (TPS2061, TPS2062, TPS2065, and TPS2066)
    8. 8.8  Overcurrent ( OCx)
    9. 8.9  Thermal Sense
    10. 8.10 Undervoltage Lockout
  10. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1  Power-supply Considerations
      2. 9.1.2  OC Response
      3. 9.1.3  Power Dissipation and Junction Temperature
      4. 9.1.4  Thermal Protection
      5. 9.1.5  Undervoltage Lockout (UVLO)
      6. 9.1.6  Universal Serial Bus (USB) Applications
      7. 9.1.7  Host/Self-Powered and Bus-powered Hubs
      8. 9.1.8  Low-power Bus-powered and High-Power Bus-Powered Functions
      9. 9.1.9  USB Power-distribution Requirements
      10. 9.1.10 Generic Hot-Plug Applications
  11. 10Device and Documentation Support
    1. 10.1 Device Support
    2. 10.2 Documentation Support
    3. 10.3 Receiving Notification of Documentation Updates
    4. 10.4 Support Resources
    5. 10.5 Trademarks
    6. 10.6 Electrostatic Discharge Caution
    7. 10.7 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • D|8
  • DGN|8
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.3 Thermal Information

THERMAL METRIC(1) D
(SOIC)		 DBV
(SOT-23) 		DGN
(HVSSOP)		 UNIT
8 PINS 16 PINS 5 PINS 8 PINS
RθJA Junction-to-ambient thermal resistance 119.3 81.6 208.6 53.6 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 67.6 42.7 122.9 58.7 °C/W
RθJB Junction-to-board thermal resistance 59.6 39.1 37.8 35.5 °C/W
ψJT Junction-to-top characterization parameter 20.3 10.4 14.6 2.7 °C/W
ψJB Junction-to-board characterization parameter 59.1 38.8 36.9 35.3 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance N/A N/A N/A 6.7 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.