SLVSGU5A April   2022  – July 2022 TPS22811

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Switching Characteristics
      1.      14
    8. 6.8 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Undervoltage Lockout (UVLO and UVP)
      2. 7.3.2 Overvoltage Lockout (OVLO)
      3. 7.3.3 Inrush Current, Overcurrent, and Short-Circuit Protection
        1. 7.3.3.1 Slew Rate (dVdt) and Inrush Current Control
        2. 7.3.3.2 Short-Circuit Protection
        3. 7.3.3.3 Active Current Limiting During Start-Up
      4. 7.3.4 Analog Load Current Monitor
      5. 7.3.5 Overtemperature Protection (OTP)
      6. 7.3.6 Fault Response
      7. 7.3.7 Power-Good Indication (PG)
      8. 7.3.8 Quick Output Discharge (QOD)
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Single Device, Self-Controlled
      2. 8.1.2 Parallel Operation
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Setting Undervoltage and Overvoltage Thresholds
        2. 8.2.2.2 Setting Output Voltage Rise Time (tR)
        3. 8.2.2.3 Setting Power-Good Assertion Threshold
        4. 8.2.2.4 Setting Analog Current Monitor Voltage (IMON) Range
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
    1. 9.1 Transient Protection
    2. 9.2 Output Short-Circuit Measurements
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Support Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.3.5 Overtemperature Protection (OTP)

The device monitors the internal die temperature (TJ) at all times and shuts down the part as soon as the temperature exceeds a safe operating level (TSD) thereby protecting the device from damage. The device does turn back on until the junction cools down sufficiently, that is the die temperature falls below (TSD – TSDHYS).

When the TPS22811x detects thermal overload, it shuts down and remains latched-off until the device is power cycled or re-enabled.

Table 7-1 Thermal Shutdown
Enter TSDExit TSD
TJ ≥ TSDTJ < TSD – TSDHYS

VIN cycled to 0 V and then above VUVP(R) or EN/UVLO toggled below VSD(F)