SLVS749C November   2008  – January 2015 TPS22921 , TPS22922

UNLESS OTHERWISE NOTED, this document contains PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Typical Application
  5. 5 Revision History
  6. 6 Device Comparison Table
  7. 7 Pin Configuration and Functions
  8. 8 Specifications
    1. 8.1  Absolute Maximum Ratings
    2. 8.2  ESD Ratings
    3. 8.3  Recommended Operating Conditions
    4. 8.4  Thermal Information
    5. 8.5  Electrical Characteristics
    6. 8.6  Switching Characteristics: VIN = 0.9 V
    7. 8.7  Switching Characteristics: VIN = 1 V
    8. 8.8  Switching Characteristics: VIN = 1.1 V
    9. 8.9  Switching Characteristics: VIN = 1.2 V
    10. 8.10 Switching Characteristics: VIN = 1.8 V
    11. 8.11 Switching Characteristics: VIN = 2.5 V
    12. 8.12 Switching Characteristics: VIN = 3 V
    13. 8.13 Switching Characteristics: VIN = 3.6 V
    14. 8.14 Typical Characteristics
      1. 8.14.1 Typical DC Characteristics
      2. 8.14.2 Typical AC Characteristics (TPS22921)
      3. 8.14.3 Typical AC Characteristics (TPS22922)
      4. 8.14.4 Typical AC Characteristics (TPS22922B)
      5. 8.14.5 Typical AC Characteristics (TPS22921 and TPS22922)
      6. 8.14.6 Typical AC Characteristics (TPS22921)
      7. 8.14.7 Typical AC Characteristics (TPS22922)
      8. 8.14.8 Typical AC Characteristics (TPS22922B)
  9. 9 Parameter Measurement Information
  10. 10Detailed Description
    1. 10.1 Overview
    2. 10.2 Functional Block Diagram
    3. 10.3 Feature Description
      1. 10.3.1 ON/OFF Control
      2. 10.3.2 Quick Output Discharge
    4. 10.4 Device Functional Modes
  11. 11Application and Implementation
    1. 11.1 Application Information
      1. 11.1.1 Input Capacitor (Optional)
      2. 11.1.2 Output Capacitor (Optional)
    2. 11.2 Typical Application
      1. 11.2.1 Design Requirements
      2. 11.2.2 Detailed Design Procedure
        1. 11.2.2.1 Managing Inrush Current
        2. 11.2.2.2 VIN to VOUT Voltage Drop
      3. 11.2.3 Application Curve
  12. 12Power Supply Recommendations
  13. 13Layout
    1. 13.1 Layout Guidelines
    2. 13.2 Layout Example
  14. 14Device and Documentation Support
    1. 14.1 Related Links
    2. 14.2 Trademarks
    3. 14.3 Electrostatic Discharge Caution
    4. 14.4 Glossary
  15. 15Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5 Revision History

Changes from B Revision (May 2012) to C Revision

  • Added Pin Configuration and Functions section, ESD Rating table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section Go

Changes from A Revision (December 2008) to B Revision

  • Changed Feature From: Ultra-Low Quiescent Current: 78 nA at 1.8 V To: Ultra-Low Quiescent Current: Typical 78 nA at 1.8 VGo
  • Changed Feature From: Typical 78 nA at 1.8 V To: Ultra-Low Shutdown Current: Typical 35 nA at 1.8 VGo
  • Changed Feature From: Six Terminal Wafer-Chip-Scale Package To: Six Terminal Wafer-Chip-Scale Package (nominal dimensions shown - see addendum for detailsGo
  • Changed Feature From: 0.5-mm Height To: 0.5-mm Height (YFP)Go
  • Changed TPS22921 QUICK OUTPUT DISCHARGE From: - To: NoGo
  • Changed the format of the ELECTRICAL CHARACTERISTICS Test Conditions From: VIN = 1-V to VIN = 1 VGo
  • Deleted Note 1 - RL_CHIP = 120 Ω from all SWITCHING CHARACTERISTICS tablesGo
  • Changed Figure 50 title From: tOFF Response To: tON ResponseGo

Changes from * Revision (November 2008) to A Revision

  • Added Note A to the TYPICAL APPLICATION circuitGo