SLVSFK0A May   2024  – August 2024 TPS22991

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison Table
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics (Version C, CN)
    7. 6.7 Switching Characteristics (Version B, BN)
  8. 7 Typical Characteristics
  9. 8 Parameter Measurement Information
  10. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 On and Off Control
      2. 9.3.2 Quick Output Discharge
      3. 9.3.3 Thermal Shutdown
      4. 9.3.4 Input Capacitor (CIN)
      5. 9.3.5 Output Capacitor (CL)
    4. 9.4 Device Functional Modes
  11. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
      3. 10.2.3 Application Curves
    3. 10.3 Power Supply Recommendations
    4. 10.4 Layout
      1. 10.4.1 Layout Guidelines
      2. 10.4.2 Layout Example
  12. 11Device and Documentation Support
    1. 11.1 Receiving Notification of Documentation Updates
    2. 11.2 Support Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  13. 12Revision History
  14. 13Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • RAA|4
Thermal pad, mechanical data (Package|Pins)
Orderable Information

10.2.2 Detailed Design Procedure

The input to output voltage drop in the device is determined by the RON of the device and the load current. The RON of the device depends upon the VIN condition of the device. After the RON of the device is determined based upon the VIN condition, use the below equation to calculate the input to output voltage drop.

Equation 2. ΔV = ILOAD × RON

where

  • ΔV is the voltage drop from VIN to VOUT.
  • ILOAD is the load current.
  • RON is the on-resistance of the device for a specific VIN and VBIAS.

An appropriate ILOAD must be chosen such that the IMAX specification of the device is not violated.

To determine how much inrush current is caused by the load capacitance, use Equation 3.

Equation 3. IINRUSH = CL × dVOUT / dt
where
  • IINRUSH is amount of inrush current caused by CL
  • CL is the load capacitance on VOUT
  • dt is the rise time for VOUT when the device is enabled
  • dVOUT is change in the VOUT voltage after the device is enabled.

The slew rate of the device dVOUT/dt at a given VIN voltage can be found in the electrical characteristic table for a given version. IINRUSH has to be within the IMAX and IPLS limits.