SLVSFK0A May   2024  – August 2024 TPS22991

PRODUCTION DATA  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Device Comparison Table
  6. Pin Configuration and Functions
  7. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics (Version C, CN)
    7. 6.7 Switching Characteristics (Version B, BN)
  8. Typical Characteristics
  9. Parameter Measurement Information
  10. Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 On and Off Control
      2. 9.3.2 Quick Output Discharge
      3. 9.3.3 Thermal Shutdown
      4. 9.3.4 Input Capacitor (CIN)
      5. 9.3.5 Output Capacitor (CL)
    4. 9.4 Device Functional Modes
  11. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
      3. 10.2.3 Application Curves
    3. 10.3 Power Supply Recommendations
    4. 10.4 Layout
      1. 10.4.1 Layout Guidelines
      2. 10.4.2 Layout Example
  12. 11Device and Documentation Support
    1. 11.1 Receiving Notification of Documentation Updates
    2. 11.2 Support Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  13. 12Revision History
  14. 13Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • RAA|4
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Electrical Characteristics

Typical values at VIN = 3.3V unless otherwise specified
PARAMETER TEST CONDITIONS TA MIN TYP MAX UNIT
INPUT SUPPLY (VIN)
IQ, VIN VIN quiescent current VON ≥ VIH, VOUT = Open 25°C 6 µA
–40°C to 85°C 12 µA
–55°C to 125°C 14 µA
ISD, VIN VIN shutdown current  VON ≤ VIL, VOUT = Open 25°C 14 nA
–40°C to 85°C 20 µA
–55°C to 125°C 67 µA
ISD, VIN VIN shutdown current VON ≤ VIL, VOUT = GND VON ≤ VIL, VOUT = GND 25°C 15 nA
–40°C to 85°C 20 µA
–55°C to 125°C 67 µA
ON-RESISTANCE (RON)
RON ON-state resistance IOUT = –200mA VIN = 5V 25°C 25 mΩ
–40°C to 85°C 35 mΩ
–40°C to 105°C 38 mΩ
–55°C to 125°C 40 mΩ
VIN = 3.3V 25°C 25 mΩ
–40°C to 85°C 35 mΩ
–40°C to 105°C 38 mΩ
–55°C to 125°C 40 mΩ
VIN = 1.8V 25°C 25 mΩ
–40°C to 85°C 35 mΩ
–40°C to 105°C 38 mΩ
–55°C to 125°C 40 mΩ
VIN = 1V 25°C 35 mΩ
–40°C to 85°C 48 mΩ
–40°C to 105°C 52 mΩ
–55°C to 125°C 60 mΩ
THERMAL SHUTDOWN (TSD)
TSD,R Thermal shutdown Rising 170
TSD,F Thermal shutdown Falling 150
ENABLE PIN (ON)
ION ON pin leakage VON ≥ VIH –55°C to 125°C 100 nA
RPD, ON Smart pull down resistance VON ≤ VIL –55°C to 125°C 500 kΩ
VIH,ON ON pin threshold (VIH rising) –55°C to 125°C 0.8 V
VHys,ON ON pin threshold (hysteresis) –55°C to 125°C 0.07 V
VIL,ON ON pin threshold (VIL falling) –55°C to 125°C 0.35 V
QUICK OUTPUT DISCHARGE (QOD)
RQOD QOD pin internal discharge resistance (Version B, C) VON ≤ VIL VIN = 1V –55°C to 125°C 190
VIN = 3.3V –55°C to 125°C 150
VIN = 5V –55°C to 125°C 140