SLUSCD1C June 2017 – November 2018 TPS2373
PRODUCTION DATA.
Refer to the PDF data sheet for device specific package drawings
THERMAL METRIC(1) | TPS2373-3 | TPS2373-4 | UNIT | |
---|---|---|---|---|
RGW (VQFN) | RGW (VQFN) | |||
20 PINS | 20 PINS | |||
RθJA | Junction-to-ambient thermal resistance | 40.2 | 38.0 | °C/W |
RθJC(top) | Junction-to-case (top) thermal resistance | 34.6 | 28.1 | °C/W |
RθJB | Junction-to-board thermal resistance | 17.9 | 16.1 | °C/W |
ψJT | Junction-to-top characterization parameter | 0.5 | 0.3 | °C/W |
ψJB | Junction-to-board characterization parameter | 17.8 | 16.0 | °C/W |
RθJC(bot) | Junction-to-case (bottom) thermal resistance | 3.4 | 1.8 | °C/W |