SLVS930C December   2009  – October 2020 TPS2560 , TPS2561

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 ESD Ratings: Surge
    4. 7.4 Recommended Operating Conditions
    5. 7.5 Thermal Information
    6. 7.6 Electrical Characteristics
    7. 7.7 Dissipation Ratings
    8. 7.8 Typical Characteristics
  8. 8 Parameter Measurement Information
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Overcurrent Conditions
      2. 9.3.2 FAULTx Response
      3. 9.3.3 Undervoltage Lockout (UVLO)
      4. 9.3.4 Enable ( ENx or ENx)
      5. 9.3.5 Thermal Sense
    4. 9.4 Device Functional Modes
  10. 10Power Supply Recommendations
    1. 10.1 Self-Powered and Bus-Powered Hubs
    2. 10.2 Low-Power Bus-Powered and High-Power Bus-Powered Functions
  11. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 Power Dissipation
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Receiving Notification of Documentation Updates
    2. 12.2 Support Resources
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6 Pin Configuration and Functions

GUID-FDBE7B40-7513-4A51-9590-3CC77632F468-low.gifDRC Package,10-Pin VSON,Top View
Table 6-1 Pin Functions
PIN I/O DESCRIPTION
NAME TPS2560 TPS2561
EN1 4 — I Enable input, logic low turns on channel one power switch.
EN1 — 4 I Enable input, logic high turns on channel one power switch.
EN2 5 — I Enable input, logic low turns on channel two power switch.
EN2 — 5 I Enable input, logic high turns on channel two power switch.
GND 1 1 — Ground connection; connect externally to the thermal pad.
IN 2, 3 2, 3 I Input voltage; connect a 0.1 μF or greater ceramic capacitor from IN to GND as close to the IC as possible.
FAULT1 10 10 O Active-low open-drain output, asserted during overcurrent or overtemperature condition on channel one.
FAULT2 6 6 O Active-low open-drain output, asserted during overcurrent or overtemperature condition on channel two.
OUT1 9 9 O Power-switch output for channel one.
OUT2 8 8 O Power-switch output for channel two.
ILIM 7 7 O External resistor used to set current-limit threshold;
recommended 20 kΩ ≤ RILIM ≤ 187 kΩ.
Thermal pad PAD PAD — Internally connected to GND; used to heat-sink the part to the circuit board traces. Connect the thermal pad to GND pin externally.