SLVSGT8 December   2022 TPS25961

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Switching Characteristics
    8. 6.8 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Undervoltage Protection (UVP) and Undervoltage Lockout (UVLO)
      2. 7.3.2 Overvoltage Protection
      3. 7.3.3 Inrush Current, Overcurrent and Short Circuit Protection
        1. 7.3.3.1 Slew Rate and Inrush Current Control (dVdt)
        2. 7.3.3.2 Active Current Limiting
        3. 7.3.3.3 Short-Circuit Protection
      4. 7.3.4 Overtemperature Protection (OTP)
      5. 7.3.5 Fault Response
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Adapter input protection for set-top boxes
      2. 8.2.2 Design Requirements
      3. 8.2.3 Detailed Design Procedure
        1. 8.2.3.1 Programming the Current-Limit Threshold: RILM Selection
        2. 8.2.3.2 Undervoltage and Overvoltage Lockout Set Point
        3. 8.2.3.3 Output Voltage Rise Time (tR)
      4. 8.2.4 Application Curves
    3. 8.3 Application Example
      1. 8.3.1 Application Curves
    4. 8.4 Power Supply Recommendations
      1. 8.4.1 Transient Protection
      2. 8.4.2 Output Short-Circuit Measurements
    5. 8.5 Layout
      1. 8.5.1 Layout Guidelines
      2. 8.5.2 Layout Example
  9. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  10. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.4 Thermal Information

THERMAL METRIC (1)(2) TPS25961 UNIT
DRV (SON)
6 PINS
RθJA Junction-to-ambient thermal resistance 74.1 °C/W
RθJCtop Junction-to-case (top) thermal resistance 80.4 °C/W
RθJCbot Junction-to-case (bottom) thermal resistance 16.8 °C/W
RθJB Junction-to-board thermal resistance 39.0 °C/W
ΨJT Junction-to-top characterization parameter 4.9 °C/W
ΨJB Junction-to-board characterization parameter 38.8 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.
(2) Based on simulations conducted with the device mounted on a custom 4-layer PCB (2s2p)