SLVSEI3C October   2018  – May 2020 TPS25982

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Simplified Schematics
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
    1.     Pin Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements
    7. 7.7 Switching Characteristics
    8. 7.8 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Undervoltage Protection (UVLO and UVP)
      2. 8.3.2 Overvoltage Protection (OVP)
      3. 8.3.3 Inrush Current, Overcurrent, and Short-Circuit Protection
        1. 8.3.3.1 Slew Rate and Inrush Current Control (dVdt)
        2. 8.3.3.2 Circuit Breaker
        3. 8.3.3.3 Active Current Limiting
        4. 8.3.3.4 Short-Circuit Protection
      4. 8.3.4 Overtemperature Protection (OTP)
      5. 8.3.5 Analog Load Current Monitor (IMON)
      6. 8.3.6 Power Good (PG)
      7. 8.3.7 Load Detect/Handshake (LDSTRT)
    4. 8.4 Fault Response
    5. 8.5 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application: Standby Power Rail Protection in Datacenter Servers
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Device Selection
        2. 9.2.2.2 Setting the Current Limit Threshold: RILIM Selection
        3. 9.2.2.3 Setting the Undervoltage Lockout Set Point
        4. 9.2.2.4 Choosing the Current Monitoring Resistor: RIMON
        5. 9.2.2.5 Setting the Output Voltage Ramp Time (TdVdt)
          1. 9.2.2.5.1 Case 1: Start-Up Without Load: Only Output Capacitance COUT Draws Current
          2. 9.2.2.5.2 Case 2: Start-Up With Load: Output Capacitance COUT and Load Draw Current
        6. 9.2.2.6 Setting the Load Handshake (LDSTRT) Delay
        7. 9.2.2.7 Setting the Transient Overcurrent Blanking Interval (tITIMER)
        8. 9.2.2.8 Setting the Auto-Retry Delay and Number of Retries
      3. 9.2.3 Application Curves
    3. 9.3 System Examples
      1. 9.3.1 Optical Module Power Rail Path Protection
        1. 9.3.1.1 Design Requirements
        2. 9.3.1.2 Device Selection
        3. 9.3.1.3 External Component Settings
        4. 9.3.1.4 Voltage Drop
        5. 9.3.1.5 Application Curves
      2. 9.3.2 Input Protection for 12-V Rail Applications: PCIe Cards, Storage Interfaces and DC Fans
  10. 10Power Supply Recommendations
    1. 10.1 Transient Protection
    2. 10.2 Output Short-Circuit Measurements
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
        1. 12.1.1.1 Related Links
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Community Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)
Parameter Pin MIN MAX UNIT
VIN Maximum Input Voltage Range IN –0.3 30 V
VOUT Maximum Output Voltage Range OUT –0.8 min (30V, VIN + 0.3) V
VEN/UVLO Maximum Enable Pin Voltage Range EN/UVLO –0.3 7 V
VLDSTRT Maximum LDSTRT Pin Voltage Range LDSTRT 7 V
VdVdt Maximum dVdt Pin Voltage Range dVdt Internally Limited V
VPG Maximum PG Pin Voltage Range PG –0.3 7 V
VITIMER Maximum ITIMER Pin Voltage Range ITIMER Internally Limited V
VNRETRY Maximum NRETRY Pin Voltage Range NRETRY Internally Limited V
VRETRY_DLY Maximum RETRY_DLY Pin Voltage Range RETRY_DLY Internally Limited V
IMAX Maximum Continuous Switch Current IN to OUT Internally Limited A
TJ Junction temperature Internally Limited °C
TLEAD Maximum Soldering Temperature 300 °C
Tstg Storage temperature –65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Rating may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.