SLVSHR9 December   2024 TPS25984B

PRODUCTION DATA  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Device Comparison Table
  6. Pin Configuration and Functions
  7. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Logic Interface
    7. 6.7 Timing Requirements
    8. 6.8 Switching Characteristics
    9. 6.9 Typical Characteristics
  8. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Undervoltage Protection
      2. 7.3.2  Insertion Delay
      3. 7.3.3  Overvoltage Protection
      4. 7.3.4  Inrush Current, Overcurrent, and Short-Circuit Protection
        1. 7.3.4.1 Slew Rate (dVdt) and Inrush Current Control
          1. 7.3.4.1.1 Start-Up Time Out
        2. 7.3.4.2 Steady-State Overcurrent Protection (Circuit-Breaker)
        3. 7.3.4.3 Active Current Limiting During Start-Up
        4. 7.3.4.4 Short-Circuit Protection
      5. 7.3.5  Analog Load Current Monitor (IMON)
      6. 7.3.6  Mode Selection (MODE)
      7. 7.3.7  Digital Overcurrent Indication (D_OC)
      8. 7.3.8  Stacking Multiple eFuses for Scalability
        1. 7.3.8.1 Current Balancing During Start-Up
      9. 7.3.9  Analog Junction Temperature Monitor (TEMP)
      10. 7.3.10 Overtemperature Protection
      11. 7.3.11 Fault Response and Indication (GOK/FLT)
      12. 7.3.12 Power-Good Indication (PG)
      13. 7.3.13 Output Discharge
      14. 7.3.14 FET Health Monitoring
    4. 7.4 Device Functional Modes
  9. Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Single Device, Standalone Operation
      2. 8.1.2 Multiple Devices, Parallel Connection
      3. 8.1.3 Digital Telemetry Using External Microcontroller
    2. 8.2 Typical Application: 12V, 3.3kW Power Path Protection in Data Center Servers
      1. 8.2.1 Application
      2. 8.2.2 Design Requirements
      3. 8.2.3 Detailed Design Procedure
      4. 8.2.4 Application Curves
    3. 8.3 Power Supply Recommendations
      1. 8.3.1 Transient Protection
      2. 8.3.2 Output Short-Circuit Measurements
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Application Curves

All the waveforms below are captured on an evaluation setup with six (6) TPS25984Bx eFuses in parallel. All the pullup supplies are derived from a separate standby rail.

TPS25984B Input Hot Plug: VIN Stepped Up from 0V to 12V, CLOAD = 40mF, CDVDT = 43nF, and RILIM on Each Device = 2kΩFigure 8-5 Input Hot Plug: VIN Stepped Up from 0V to 12V, CLOAD = 40mF, CDVDT = 43nF, and RILIM on Each Device = 2kΩ
TPS25984B Power Up into Short: VIN = 12V, EN/UVLO Stepped Up From 0V to 3V, RIREF = 27kΩ, RILIM on Each Device = 2kΩ, and OUT Shorted to GNDFigure 8-7 Power Up into Short: VIN = 12V, EN/UVLO Stepped Up From 0V to 3V, RIREF = 27kΩ, RILIM on Each Device = 2kΩ, and OUT Shorted to GND
TPS25984B Output Hot-Short Response: VIN = 12V, RIMON = 167Ω, RIREF = 27kΩ, and OUT Shorted to GNDFigure 8-9 Output Hot-Short Response: VIN = 12V, RIMON = 167Ω, RIREF = 27kΩ, and OUT Shorted to GND
TPS25984B Start-up with EN/UVLO: VIN = 12V, EN/UVLO Stepped Up From 0V to 3V, CLOAD = 40mF, RLOAD(Start-up) = 0.48Ω, CDVDT = 43nF, and RILIM on Each Device = 2kΩFigure 8-6 Start-up with EN/UVLO: VIN = 12V, EN/UVLO Stepped Up From 0V to 3V, CLOAD = 40mF, RLOAD(Start-up) = 0.48Ω, CDVDT = 43nF, and RILIM on Each Device = 2kΩ
TPS25984B Circuit-Breaker Response: VIN = 12V, CLOAD = 40mF, RIMON = 167Ω, RIREF = 27kΩ, and Load Current Stepped up From 250A to 510AFigure 8-8 Circuit-Breaker Response: VIN = 12V, CLOAD = 40mF, RIMON = 167Ω, RIREF = 27kΩ, and Load Current Stepped up From 250A to 510A
TPS25984B Six Devices in Parallel Temperature Rise with 300A total DC Current at Room Temperature (No Air-Flow)Figure 8-10 Six Devices in Parallel Temperature Rise with 300A total DC Current at Room Temperature (No Air-Flow)