SLVSDT4F October   2017  – December 2021 TPS2662

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements
    7. 7.7 Typical Characteristics
  8. 8 Parameter Measurement Information
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Undervoltage Lockout (UVLO)
      2. 9.3.2 Overvoltage Protection (OVP)
      3. 9.3.3 Hot Plug-In and Inrush Current Control
      4. 9.3.4 Reverse Polarity Protection
        1. 9.3.4.1 Input Side Reverse Polarity Protection
        2. 9.3.4.2 Output Side Reverse Polarity Protection
      5. 9.3.5 Overload and Short-Circuit Protection
        1. 9.3.5.1 Overload Protection
        2.       28
        3. 9.3.5.2 Short-Circuit Protection
          1. 9.3.5.2.1 Start-Up With Short-Circuit On Output
      6. 9.3.6 Reverse Current Protection
      7. 9.3.7 FAULT Response
      8. 9.3.8 IN, OUT, RTN, and GND Pins
      9. 9.3.9 Thermal Shutdown
    4. 9.4 Device Functional Modes
      1. 9.4.1 Low Current Shutdown Control (SHDN)
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
        1. 10.2.2.1 Step-by-Step Design Procedure
        2. 10.2.2.2 Programming the Current Limit Threshold R(ILIM) Selection
        3. 10.2.2.3 Undervoltage Lockout and Overvoltage Set Point
        4. 10.2.2.4 Setting Output Voltage Ramp Time—(tdVdT)
          1. 10.2.2.4.1 Case 1: Start-Up Without Load—Only Output Capacitance C(OUT) Draws Current During Start-Up
          2. 10.2.2.4.2 Case 2: Start-Up With Load —Output Capacitance C(OUT) and Load Draws Current During Start-Up
          3. 10.2.2.4.3 Support Component Selections – R FLT and C(IN)
      3. 10.2.3 Application Curves
    3. 10.3 System Examples
      1. 10.3.1 Field Supply Protection in PLC, DCS I/O Modules
      2. 10.3.2 Simple 24-V Power Supply Path Protection
      3. 10.3.3 Power Stealing in Smart Thermostat
    4. 10.4 Do's and Don'ts
  11. 11Power Supply Recommendations
    1. 11.1 Transient Protection
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Documentation Support
      1. 13.1.1 Related Documentation
    2. 13.2 Receiving Notification of Documentation Updates
    3. 13.3 Support Resources
    4. 13.4 Trademarks
    5. 13.5 Electrostatic Discharge Caution
    6. 13.6 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.4 Thermal Information

THERMAL METRIC(1) TPS2662 UNIT
DRC (VSON)
10 PINS
RθJA Junction-to-ambient thermal resistance 44.8 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 39.5 °C/W
RθJB Junction-to-board thermal resistance 20.7 °C/W
ΨJT Junction-to-top characterization parameter 0.5 °C/W
ΨJB Junction-to-board characterization parameter 20.7 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 3.4 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.