SLVSE94G September   2018  – June 2024 TPS2663

PRODUCTION DATA  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Device Comparison Table
  6. Pin Configuration and Functions
  7. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Typical Characteristics
  8. Parameter Measurement Information
  9. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  Hot Plug-In and Inrush Current Control
        1. 8.3.1.1 Thermal Regulation Loop
      2. 8.3.2  PGOOD and PGTH
        1. 8.3.2.1 PGTH as VOUT Sensing Input
      3. 8.3.3  Undervoltage Lockout (UVLO)
      4. 8.3.4  Overvoltage Protection (OVP)
      5. 8.3.5  Input Reverse Polarity Protection (B_GATE, DRV)
      6. 8.3.6  Reverse Current Protection
      7. 8.3.7  Overload and Short-Circuit Protection
        1. 8.3.7.1 Overload Protection
          1. 8.3.7.1.1 Active Current Limiting at 1 × IOL (TPS26630 and TPS26632 Only)
          2. 8.3.7.1.2 Active Current Limiting With 2 × IOL Pulse Current Support (TPS26631, TPS26633, TPS26635, TPS26636, and TPS26637 Only)
        2. 8.3.7.2 Short-Circuit Protection
          1. 8.3.7.2.1 Start-Up With Short Circuit on Output
      8. 8.3.8  Output Power Limiting, PLIM (TPS26632, TPS26633, TPS26635, TPS26636, and TPS26637 Only)
      9. 8.3.9  Current Monitoring Output (IMON)
      10. 8.3.10 FAULT Response (FLT)
      11. 8.3.11 IN_SYS, IN, OUT, and GND Pins
      12. 8.3.12 Thermal Shutdown
      13. 8.3.13 Low Current Shutdown Control (SHDN)
    4. 8.4 Device Functional Modes
  10. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application: Power Path Protection in a PLC System
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Programming the Current-Limit Threshold—R(ILIM) Selection
        2. 9.2.2.2 Undervoltage Lockout and Overvoltage Set Point
        3. 9.2.2.3 Output Buffer Capacitor – COUT
        4. 9.2.2.4 PGTH Set Point
        5. 9.2.2.5 Setting Output Voltage Ramp Time—(tdVdT)
          1. 9.2.2.5.1 Support Component Selections— RPGOOD and C(IN)
        6. 9.2.2.6 Selecting Q1, Q2 and TVS Clamp for Surge Protection
      3. 9.2.3 Application Curves
    3. 9.3 System Examples
      1. 9.3.1 Simple 24-V Power Supply Path Protection
      2. 9.3.2 Priority Power MUX Operation
      3. 9.3.3 Input Protection for a Compact 24-V Auxiliary Power Supply for Servo Drives
    4. 9.4 Dos and Do Nots
    5. 9.5 Power Supply Recommendations
      1. 9.5.1 Transient Protection
    6. 9.6 Layout
      1. 9.6.1 Layout Guidelines
      2. 9.6.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • RGE|24
  • PWP|20
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Transient Protection

In case of short-circuit and overload current limit, when the device interrupts current flow, input inductance generates a positive voltage spike on the input and output inductance generates a negative voltage spike on the output. The peak amplitude of voltage spikes (transients) depends on the value of inductance in series to the input or output of the device. These transients can exceed the Absolute Maximum Ratings of the device if steps are not taken to address the issue.

Typical methods for addressing transients include:

  • Minimizing lead length and inductance into and out of the device
  • Using large PCB GND plane
  • Using a Schottky diode across the output and GND to absorb negative spikes
  • Using a low value ceramic capacitor (C(IN) to approximately 0.1 μF) to absorb the energy and dampen the transients.

The approximate value of input capacitance can be estimated with Equation 14

Equation 14. TPS2663

where

  • V(IN) is the nominal supply voltage
  • I(LOAD) is the load current
  • L(IN) equals the effective inductance seen looking into the source
  • C(IN) is the capacitance present at the input

Some applications can require additional Transient Voltage Suppressor (TVS) to prevent transients from exceeding the Absolute Maximum Ratings of the device. These transients can occur during positive and negative surge tests on the supply lines. In such applications, TI recommends to place at least 1 µF of input capacitor.

Figure 10-1 shows the circuit implementation with optional protection components (a ceramic capacitor, TVS and, Schottky diode).

TPS2663 Circuit Implementation With Optional
                    Protection Components for TPS2663x
* Optional components needed for suppression of transients
Figure 9-17 Circuit Implementation With Optional Protection Components for TPS2663x