SLVSH67 September   2024 TPS26750

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
      1. 5.1.1 TPS26750 - Absolute Maximum Ratings
      2. 5.1.2 TPS26750 - Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
      1. 5.3.1 TPS26750 - Recommended Operating Conditions
    4. 5.4  Recommended Capacitance
    5. 5.5  Thermal Information
      1. 5.5.1 TPS26750 - Thermal Information
    6. 5.6  Power Supply Characteristics
    7. 5.7  Power Consumption
    8. 5.8  PP_5V Power Switch Characteristics
    9. 5.9  POWER_PATH_EN Characteristics - TPS26750
    10. 5.10 Power Path Supervisory
    11. 5.11 CC Cable Detection Parameters
    12. 5.12 CC VCONN Parameters
    13. 5.13 CC PHY Parameters
    14. 5.14 Thermal Shutdown Characteristics
    15. 5.15 ADC Characteristics
    16. 5.16 Input/Output (I/O) Characteristics
    17. 5.17 BC1.2 Characteristics
    18. 5.18 I2C Requirements and Characteristics
    19. 5.19 Typical Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  USB-PD Physical Layer
        1. 7.3.1.1 USB-PD Encoding and Signaling
        2. 7.3.1.2 USB-PD Bi-Phase Marked Coding
        3. 7.3.1.3 USB-PD Transmit (TX) and Receive (Rx) Masks
        4. 7.3.1.4 USB-PD BMC Transmitter
        5. 7.3.1.5 USB-PD BMC Receiver
        6. 7.3.1.6 Squelch Receiver
      2. 7.3.2  Power Management
        1. 7.3.2.1 Power-On And Supervisory Functions
        2. 7.3.2.2 VBUS LDO
      3. 7.3.3  Power Paths
        1. 7.3.3.1 Internal Sourcing Power Paths
          1. 7.3.3.1.1 PP_5V Current Clamping
          2. 7.3.3.1.2 PP_5V Local Overtemperature Shut Down (OTSD)
          3. 7.3.3.1.3 PP_5V OVP
          4. 7.3.3.1.4 PP_5V UVLO
          5. 7.3.3.1.5 PP_5Vx Reverse Current Protection
          6. 7.3.3.1.6 PP_CABLE Current Clamp
          7. 7.3.3.1.7 PP_CABLE Local Overtemperature Shut Down (OTSD)
          8. 7.3.3.1.8 PP_CABLE UVLO
      4. 7.3.4  Cable Plug and Orientation Detection
        1. 7.3.4.1 Configured as a Source
        2. 7.3.4.2 Configured as a Sink
        3. 7.3.4.3 Configured as a DRP
        4. 7.3.4.4 Dead Battery Advertisement
      5. 7.3.5  Overvoltage Protection (CC1, CC2)
      6. 7.3.6  Default Behavior Configuration (ADCIN1, ADCIN2)
      7. 7.3.7  ADC
      8. 7.3.8  BC 1.2 (USB_P, USB_N)
      9. 7.3.9  Digital Interfaces
        1. 7.3.9.1 General GPIO
        2. 7.3.9.2 I2C Interface
      10. 7.3.10 Digital Core
      11. 7.3.11 I2C Interface
        1. 7.3.11.1 I2C Interface Description
          1. 7.3.11.1.1 I2C Clock Stretching
          2. 7.3.11.1.2 I2C Address Setting
          3. 7.3.11.1.3 Unique Address Interface
    4. 7.4 Device Functional Modes
      1. 7.4.1 Pin Strapping to Configure Default Behavior
      2. 7.4.2 Power States
    5. 7.5 Thermal Shutdown
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
        1. 8.2.1.1 Programmable Power Supply (PPS) - Design Requirements
        2. 8.2.1.2 Liquid Detection Design Requirements
        3. 8.2.1.3 BC1.2 Application Design Requirements
        4. 8.2.1.4 USB Data Support Design Requirements
        5. 8.2.1.5 EPR Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Programmable Power Supply (PPS)
        2. 8.2.2.2 Liquid Detection
        3. 8.2.2.3 BC1.2 Application
        4. 8.2.2.4 USB Data Support
        5. 8.2.2.5 Power Delivery EPR Support
      3. 8.2.3 Application Curves
        1. 8.2.3.1 Programmable Power Supply (PPS) Application Curves
        2. 8.2.3.2 Liquid Detection Application Curves
        3. 8.2.3.3 BC1.2 Application Curves
        4. 8.2.3.4 USB Data Support Application Curves
        5. 8.2.3.5 EPR Application Curves
    3. 8.3 Power Supply Recommendations
      1. 8.3.1 3.3V Power
        1. 8.3.1.1 VIN_3V3 Input Switch
      2. 8.3.2 1.5V Power
      3. 8.3.3 Recommended Supply Load Capacitance
    4. 8.4 Layout
      1. 8.4.1 TPS26750 - Layout
        1. 8.4.1.1 Layout Guidelines
          1. 8.4.1.1.1 Recommended Via Size
          2. 8.4.1.1.2 Minimum Trace Widths
        2. 8.4.1.2 Layout Example
          1. 8.4.1.2.1 TPS26750 Schematic Layout Example
          2. 8.4.1.2.2 TPS26750 Layout Example - PCB Plots
            1. 8.4.1.2.2.1 TPS26750 Component Placement
            2. 8.4.1.2.2.2 TPS26750 PP5V
            3. 8.4.1.2.2.3 TPS26750 PP_EXT
            4. 8.4.1.2.2.4 TPS26750 VBUS
            5. 8.4.1.2.2.5 TPS26750 I/O
            6. 8.4.1.2.2.6 TPS26750 PPEXT Gate Driver
            7. 8.4.1.2.2.7 TPS26750 GND
  10. 9 Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Third-Party Products Disclaimer
    2. 9.2 Documentation Support
      1. 9.2.1 Related Documentation
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • RSM|32
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.3.11.1 I2C Interface Description

The TPS26750 supports Standard and Fast mode I2C interfaces. The bidirectional I2C bus consists of the serial clock (SCL) and serial data (SDA) lines. Both lines must be connected to a supply through a pullup resistor. Data transfer can be initiated only when the bus is not busy.

A controller sending a Start condition, a high-to-low transition on the SDA input and output, while the SCL input is high initiates I2C communication. After the Start condition, the device address byte is sent, most significant bit (MSB) first, including the data direction bit (R/W).

After receiving the valid address byte, this device responds with an acknowledge (ACK), a low on the SDA input/output during the high of the ACK-related clock pulse. On the I2C bus, only one data bit is transferred during each clock pulse. The data on the SDA line must remain stable during the high pulse of the clock period as changes in the data line at this time are interpreted as control commands (Start or Stop). The controller sends a Stop condition, a low-to-high transition on the SDA input and output while the SCL input is high.

Any number of data bytes can be transferred from the transmitter to receiver between the Start and the Stop conditions. Each byte of eight bits is followed by one ACK bit. The transmitter must release the SDA line before the receiver can send an ACK bit. The device that acknowledges must pull down the SDA line during the ACK clock pulse, so that the SDA line is stable low during the high pulse of the ACK-related clock period. When a target receiver is addressed, it must generate an ACK after each byte is received. Similarly, the controller must generate an ACK after each byte that it receives from the target transmitter. Setup and hold times must be met to ensure proper operation.

A controller receiver signals an end of data to the target transmitter by not generating an acknowledge (NACK) after the last byte has been clocked out of the target. The controller receiver holding the SDA line high does this. In this event, the transmitter must release the data line to enable the controller to generate a Stop condition.

Figure 7-18 shows the start and stop conditions of the transfer. Figure 7-19 shows the SDA and SCL signals for transferring a bit. Figure 7-20 shows a data transfer sequence with the ACK or NACK at the last clock pulse.

TPS26750 I2C Definition of Start and Stop ConditionsFigure 7-18 I2C Definition of Start and Stop Conditions
TPS26750 I2C Bit TransferFigure 7-19 I2C Bit Transfer
TPS26750 I2C Acknowledgment Figure 7-20 I2C Acknowledgment