SLVSBR5C December   2012  – June  2015 TPS27082L

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Dissipation Ratings
    7. 6.7 Typical Characteristics
      1. 6.7.1 PFET Q1 Minimum Safe Operating Area (SOA)
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
    4. 7.4 Device Functional Modes
      1. 7.4.1 ON/OFF
      2. 7.4.2 Fastest Output Rise Time
      3. 7.4.3 Controlled Output Rise Time
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Configuring Q1 ON-Resistance
        2. 8.2.2.2 Configuring Turnon Slew Rate
        3. 8.2.2.3 Configuring Turnoff Delay
        4. 8.2.2.4 OFF Isolation Under VIN Transients
        5. 8.2.2.5 Low Voltage ON/OFF Interface
        6. 8.2.2.6 On-Chip Power Dissipation
      3. 8.2.3 Application Curve
    3. 8.3 System Examples
      1. 8.3.1 TFT LCD Module Inrush Current Control
      2. 8.3.2 Standby Power Isolation
      3. 8.3.3 Boost Regulator With True Shutdown
      4. 8.3.4 Single Module Multiple Power Supply Sequencing
      5. 8.3.5 Multiple Modules Interdependent Power Supply Sequencing
      6. 8.3.6 Multiple Modules Interdependent Supply Sequencing Without a GPIO Input
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
    3. 10.3 Thermal Considerations
      1. 10.3.1 Improving Package Thermal Performance
  11. 11Device and Documentation Support
    1. 11.1 Community Resources
    2. 11.2 Trademarks
    3. 11.3 Electrostatic Discharge Caution
    4. 11.4 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from B Revision (September 2013) to C Revision

  • Added Pin Configuration and Functions section, Storage Conditions table, ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section Go

Changes from A Revision (April 2013) to B Revision

  • Removed Ordering Information table.Go
  • Fixed UNIT typo for ON/OFF input logic hysteresis PARAMETER.Go

Changes from * Revision (December 2012) to A Revision

  • Updated wording in the document.Go