SLVSGD3B December   2022  – August 2024 TPS281C30

PRODUCTION DATA  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Device Comparison Table
  6. Pin Configuration and Functions
  7. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 SNS Timing Characteristics
    7. 6.7 Switching Characteristics
    8. 6.8 Typical Characteristics
  8. Parameter Measurement Information
  9. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Device Functional Modes
      1. 8.3.1 Working Mode
    4. 8.4 Feature Description
      1. 8.4.1 Accurate Current Sense
        1. 8.4.1.1 High Accuracy Sense Mode
      2. 8.4.2 Programmable Current Limit
        1. 8.4.2.1 Short-Circuit and Overload Protection
        2. 8.4.2.2 Capacitive Charging
      3. 8.4.3 Inductive-Load Switching-Off Clamp
      4. 8.4.4 Inductive Load Demagnetization
      5. 8.4.5 Full Protections and Diagnostics
        1. 8.4.5.1 Open-Load Detection
        2. 8.4.5.2 Thermal Protection Behavior
        3. 8.4.5.3 Undervoltage Lockout (UVLO) Protection
        4. 8.4.5.4 Overvoltage (OVP) Protection
        5. 8.4.5.5 Reverse Polarity Protection
        6. 8.4.5.6 Protection for MCU I/Os
        7. 8.4.5.7 Diagnostic Enable Function
        8. 8.4.5.8 Loss of Ground
        9. 8.4.5.9 Enhanced EFT Immunity
  10. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
        1. 9.2.1.1 IEC 61000-4-5 Surge
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Selecting RILIM
        2. 9.2.2.2 Selecting RSNS
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
        1. 9.4.1.1 EMC Considerations
      2. 9.4.2 Layout Example
        1. 9.4.2.1 PWP Layout without a GND Network
        2. 9.4.2.2 PWP Layout with a GND Network
        3. 9.4.2.3 RGW Layout with a GND Network
      3. 9.4.3 Thermal Considerations
  11. 10Device and Documentation Support
    1. 10.1 Receiving Notification of Documentation Updates
    2. 10.2 Support Resources
    3. 10.3 Trademarks
    4. 10.4 Electrostatic Discharge Caution
    5. 10.5 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)

Enhanced EFT Immunity

TPS281C30E has an enchanced EFT immunity compared to the other variants. The E variant implemented a stronger gate pulldown circuit which helps the device in the OFF state to stay OFF when an EFT pulses comes in. Due to the active circuit in the OFF state, the E variant will draw a higher current from the supply during the OFF state IQ(OFF)compared to the other variants. E version device will have Hi-Z on the output while OFF, with leakage current IOUT(OFF).

The max EFT voltage level V(EFT) will largely depending on the components used in the test circuit. The larger the output capacitor, and the smaller the coupling capacitor, the higher the EFT voltage level can be tolerated. As the coupling capacitor value is fixed in most EFT standards, increasing the output capacitor value can be an effecitive way to increase the maximum EFT voltage level.

Figure 8-21 shows the setup for EFT testing. TPS281C30E is tested to pass +/- 2.5 kV EFT at VS and VOUT with 10nF output capacitor and 100pF coupling capacitor as shown in the diagram. The output capacitor can be increased if passing higher level of EFT is desired. The A, B, C, D variants are tested to pass +/- 2 kV EFT at VS and VOUT with 22nF output capacitor and 100pF coupling capacitor. The DIAG_EN has to be high for A, B, C, D version in the OFF state in order to not enter the sleep state and have the EFT immunity stated above, while the DIAG_EN can be either high or low for E version as the EFT protection circuit is always active. The test conditions are outlined in EFT Test Conditions.

There is a strong pulldown circuitry to keep the power FET OFF during OFF state EFT transient. The circuitry is activated after EFTDELAY period to not affect the normal turn-off slew rate. However, the part is not protected during the EFTDELAY period as illustrated in Figure 8-22.

TPS281C30 EFT Test Setup Figure 8-21 EFT Test Setup
TPS281C30 EFT Timing Diagram Figure 8-22 EFT Timing Diagram
Table 8-4 EFT Test Conditions
Device Version EFT Level COUT CCOUPLING DIAG_EN
A, B, C, D +/- 2 kV 22nF 100pF High
E +/- 2.5 kV 10nF 100pF High/Low