SBVS187G February   2012  – February 2019 TPS3700

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Simplified Schematic
      2.      Output vs Input Thresholds and Hysteresis
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Switching Characteristics
    8. 6.8 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Inputs (INA+, INB–)
      2. 7.3.2 Outputs (OUTA, OUTB)
      3. 7.3.3 Window Voltage Detector
      4. 7.3.4 Immunity to Input Terminal Voltage Transients
    4. 7.4 Device Functional Modes
      1. 7.4.1 Normal Operation (VDD > UVLO)
      2. 7.4.2 Undervoltage Lockout (V(POR) < VDD < UVLO)
      3. 7.4.3 Power-On Reset (VDD < V(POR))
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 VPULLUP to a Voltage Other Than VDD
      2. 8.1.2 Monitoring VDD
      3. 8.1.3 Monitoring a Voltage Other Than VDD
      4. 8.1.4 Monitoring Overvoltage and Undervoltage for Separate Rails
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Resistor Divider Selection
        2. 8.2.2.2 Pullup Resistor Selection
        3. 8.2.2.3 Input Supply Capacitor
        4. 8.2.2.4 Input Capacitors
      3. 8.2.3 Application Curves
    3. 8.3 Do's and Don'ts
  9. 9 Power-Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Development Support
        1. 11.1.1.1 Evaluation Modules
      2. 11.1.2 Device Nomenclature
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 Community Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DSE|6
  • DDC|6
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from F Revision (January 2018) to G Revision

  • Changed comparator to voltage detector throughout datasheetGo

Changes from E Revision (February 2017) to F Revision

  • Changed comparator to supervisor throughout datasheet Go

Changes from D Revision (January 2015) to E Revision

  • Added maximum specification to Start-up delay parameter Go
  • Changed at least 150 µs to 450 µs (max) in footnote 2 of Electrical Characteristics table Go

Changes from C Revision (May 2013) to D Revision

  • Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section Go
  • Changed HBM maximum specification from 2 kV to 2.5 kV in ESD RatingsGo
  • Changed Functional Block Diagram; added hysteresis symbol Go

Changes from B Revision (April 2012) to C Revision

  • Changed Packages Features bulletGo
  • Added SON-6 package option to Description sectionGo
  • Added DSE pin out graphic to front pageGo
  • Added DSE pin out graphicGo
  • Added DSE package to Thermal Information tableGo

Changes from A Revision (February 2012) to B Revision

  • Moved to Production DataGo