The path formed from the input capacitor to the inductor and the switch node must have short trace length. The same applies for the trace from the inductor to Schottky diode to the output capacitor.
Use a ceramic input capacitor located next to the VDD pin with a short return path to the "power" GND copper. Locate input ceramic filter capacitors in close proximity to the VIN terminal. TI recommends surface-mount capacitors to minimize lead length and reduce noise coupling.
Use a low-EMI inductor with a ferrite-type shielded core. One can use other types of inductors; however, they must have low-EMI characteristics and be located away from the low-power traces and components in the circuit.
The VBP capacitor should be close to the BP pin with a short return path to the "power" GND copper.
All other analog components should be kept close to the IC such as those connected to RC, SS, COMP, FB, and ISNS. It is recommend to isolate this ground return used for these components to create a "quiet" ground minimizing any noise as shown in Figure 10-1.
Use foot print and vias pattern for the TPS40210 device as recommended towards the end of the data sheet.
The resistor divider for sensing the output voltage connects between the positive pin of the output capacitor and the GND pin (IC signal ground).