SLVS861F august   2008  – june 2020 TPS40210-Q1 , TPS40211-Q1

PRODUCTION DATA  

  1. Features
  2. Applications
  3. Description
    1.     4
  4. Revision History
  5. Pin Configuration and Functions
    1.     Pin Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Switching Characteristics
    8. 6.8 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Minimum On-Time and Off-Time Considerations
      2. 7.3.2  Current Sense and Overcurrent
      3. 7.3.3  Current Sense and Subharmonic Instability
      4. 7.3.4  Current Sense Filtering
      5. 7.3.5  Soft Start
      6. 7.3.6  BP Regulator
      7. 7.3.7  Shutdown (DIS/ EN Pin)
      8. 7.3.8  Control Loop Considerations
      9. 7.3.9  Gate Drive Circuit
      10. 7.3.10 TPS40211-Q1
    4. 7.4 Device Functional Modes
      1. 7.4.1 Setting the Oscillator Frequency
      2. 7.4.2 Synchronizing the Oscillator
  8. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1  Duty Cycle Estimation
        2. 8.2.2.2  Inductor Selection
        3. 8.2.2.3  Rectifier Diode Selection
        4. 8.2.2.4  Output Capacitor Selection
        5. 8.2.2.5  Input Capacitor Selection
        6. 8.2.2.6  Current Sense and Current Limit
        7. 8.2.2.7  Current Sense Filter
        8. 8.2.2.8  Switching MOSFET Selection
        9. 8.2.2.9  Feedback Divider Resistors
        10. 8.2.2.10 Error Amplifier Compensation
        11. 8.2.2.11 R-C Oscillator
        12. 8.2.2.12 Soft-Start Capacitor
        13. 8.2.2.13 Regulator Bypass
      3. 8.2.3 Application Curves
  9. Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Related Links
    4. 11.4 Receiving Notification of Documentation Updates
    5. 11.5 Support Resources
    6. 11.6 Trademarks
    7. 11.7 Electrostatic Discharge Caution
    8. 11.8 Glossary
  12. 12Mechanical, Packaging, and Orderable Information
    1.     69

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DGQ|10
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Layout Guidelines

  • The path formed from the input capacitor to the inductor and the switch node must have short trace length. The same applies for the trace from the inductor to Schottky diode to the output capacitor.
  • Use a ceramic input capacitor located next to the VDD pin with a short return path to the "power" GND copper. Locate input ceramic filter capacitors in close proximity to the VIN terminal. TI recommends surface-mount capacitors to minimize lead length and reduce noise coupling.
  • Use a low-EMI inductor with a ferrite-type shielded core. One can use other types of inductors; however, they must have low-EMI characteristics and be located away from the low-power traces and components in the circuit.
  • The VBP capacitor should be close to the BP pin with a short return path to the "power" GND copper.
  • All other analog components should be kept close to the IC such as those connected to RC, SS, COMP, FB, and ISNS. It is recommend to isolate this ground return used for these components to create a "quiet" ground minimizing any noise as shown in Figure 10-1.
  • Use foot print and vias pattern for the TPS40210 device as recommended towards the end of the data sheet.
  • The resistor divider for sensing the output voltage connects between the positive pin of the output capacitor and the GND pin (IC signal ground).