SLUSAF3A December   2010  – November 2016 TPS53321

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Soft Start
      2. 7.3.2 Power Good
      3. 7.3.3 Undervoltage Lockout (UVLO) Protection
      4. 7.3.4 Overcurrent Protection
      5. 7.3.5 Overvoltage Protection
      6. 7.3.6 Undervoltage Protection
      7. 7.3.7 Overtemperature Protection
      8. 7.3.8 Output Discharge
      9. 7.3.9 Master and Slave Operation and Synchronization
    4. 7.4 Device Functional Modes
      1. 7.4.1 Operation Modes
      2. 7.4.2 Eco-Mode™ Light-Load Operation
      3. 7.4.3 Forced Continuous Conduction Mode (FCCM)
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Determine the Value of R1 and R2
        2. 8.2.2.2 Choose the Inductor
        3. 8.2.2.3 Choose the Output Capacitor(s)
        4. 8.2.2.4 Choose the Input Capacitor
        5. 8.2.2.5 Compensation Design
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Receiving Notification of Documentation Updates
    2. 11.2 Community Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from * Revision (December 2010) to A Revision

  • Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information sectionGo
  • Deleted Ordering Information table; see POA at the end of the data sheetGo
  • Deleted Lead temperature, 1.6 mm (1/16 inch) from case for 10 seconds: 300°CGo
  • Deleted Package Dissipation Ratings tableGo
  • Added Thermal Information tableGo
  • Changed R2 value in Typical 3.3-V Input Application Circuit Diagram From: 4.02 kΩ To: 2.67 kΩGo
  • Changed R2 value in Master and Slave Configuration Schematic From: 4.02 kΩ To: 2.67 kΩGo
  • Changed R12 value in Master and Slave Configuration Schematic From: 2.67 kΩ To: 4.02 kΩGo