SLVS974F September   2009  – May 2020 TPS54218

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Simplified Schematic
      2.      Efficiency versus Output Current
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Fixed Frequency PWM Control
      2. 7.3.2  Slope Compensation and Output Current
      3. 7.3.3  Bootstrap Voltage (Boot) and Low Dropout Operation
      4. 7.3.4  Error Amplifier
      5. 7.3.5  Voltage Reference
      6. 7.3.6  Adjusting the Output Voltage
      7. 7.3.7  Enable and Adjusting Undervoltage Lockout
      8. 7.3.8  Soft-Start Pin
      9. 7.3.9  Sequencing
      10. 7.3.10 Constant Switching Frequency and Timing Resistor (RT/CLK Pin)
      11. 7.3.11 Overcurrent Protection
      12. 7.3.12 Frequency Shift
      13. 7.3.13 Reverse Overcurrent Protection
      14. 7.3.14 Synchronize Using the RT/CLK Pin
      15. 7.3.15 Power Good (PWRGD Pin)
      16. 7.3.16 Overvoltage Transient Protection
      17. 7.3.17 Thermal Shutdown
    4. 7.4 Device Functional Modes
      1. 7.4.1 Small Signal Model for Loop Response
      2. 7.4.2 Simple Small Signal Model for Peak Current Mode Control
      3. 7.4.3 Small Signal Model for Frequency Compensation
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1  Step One: Select the Switching Frequency
        2. 8.2.2.2  Step Two: Select the Output Inductor
        3. 8.2.2.3  Step Three: Choose the Output Capacitor
        4. 8.2.2.4  Step Four: Select the Input Capacitor
        5. 8.2.2.5  Step Five: Minimum Load DC COMP Voltage
        6. 8.2.2.6  Step Six: Choose the Soft-Start Capacitor
        7. 8.2.2.7  Step Seven: Select the Bootstrap Capacitor
        8. 8.2.2.8  Step Eight: Undervoltage Lockout Threshold
        9. 8.2.2.9  Step Nine: Select Output Voltage and Feedback Resistors
          1. 8.2.2.9.1 Output Voltage Limitations
        10. 8.2.2.10 Step 10: Select Loop Compensation Components
        11. 8.2.2.11 Power Dissipation Estimate
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Development Support
        1. 11.1.1.1 Custom Design With WEBENCH® Tools
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Support Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

10.1 Layout Guidelines

Layout is a critical portion of good power supply design. There are several signal paths that conduct fast changing currents or voltages that can interact with stray inductance or parasitic capacitance to generate noise or degrade the power supplies performance.

  • Minimize the loop area formed by the bypass capacitor connections and the VIN pins. See Figure 55 for a PCB layout example.
  • The GND pins and AGND pin must be tied directly to the power pad under the TPS54218 device. The power pad must be connected to any internal PCB ground planes using multiple vias directly under the device. Additional vias can be used to connect the top-side ground area to the internal planes near the input and output capacitors. For operation at a full-rated load, the top-side ground area along with any additional internal ground planes must provide adequate heat dissipating area.
  • Place the input bypass capacitor as close to the device as possible.
  • Route the PH pin to the output inductor. Because the PH connection is the switching node, place the output inductor close to the PH pins. Minimize the area of the PCB conductor to prevent excessive capacitive coupling.
  • The boot capacitor must also be located close to the device.
  • The sensitive analog ground connections for the feedback voltage divider, compensation components, soft-start capacitor, and frequency set resistor must be connected to a separate analog ground trace as shown in Figure 55.
  • The RT/CLK pin is particularly sensitive to noise so the RT resistor must be located as close as possible to the device and routed with minimal trace lengths.
  • The additional external components can be placed approximately as shown. It is possible to obtain acceptable performance with alternate PCB layouts, however, this layout has been shown to produce good results and can be used as a guide.