SLVS974F September   2009  – May 2020 TPS54218

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Simplified Schematic
      2.      Efficiency versus Output Current
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Fixed Frequency PWM Control
      2. 7.3.2  Slope Compensation and Output Current
      3. 7.3.3  Bootstrap Voltage (Boot) and Low Dropout Operation
      4. 7.3.4  Error Amplifier
      5. 7.3.5  Voltage Reference
      6. 7.3.6  Adjusting the Output Voltage
      7. 7.3.7  Enable and Adjusting Undervoltage Lockout
      8. 7.3.8  Soft-Start Pin
      9. 7.3.9  Sequencing
      10. 7.3.10 Constant Switching Frequency and Timing Resistor (RT/CLK Pin)
      11. 7.3.11 Overcurrent Protection
      12. 7.3.12 Frequency Shift
      13. 7.3.13 Reverse Overcurrent Protection
      14. 7.3.14 Synchronize Using the RT/CLK Pin
      15. 7.3.15 Power Good (PWRGD Pin)
      16. 7.3.16 Overvoltage Transient Protection
      17. 7.3.17 Thermal Shutdown
    4. 7.4 Device Functional Modes
      1. 7.4.1 Small Signal Model for Loop Response
      2. 7.4.2 Simple Small Signal Model for Peak Current Mode Control
      3. 7.4.3 Small Signal Model for Frequency Compensation
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1  Step One: Select the Switching Frequency
        2. 8.2.2.2  Step Two: Select the Output Inductor
        3. 8.2.2.3  Step Three: Choose the Output Capacitor
        4. 8.2.2.4  Step Four: Select the Input Capacitor
        5. 8.2.2.5  Step Five: Minimum Load DC COMP Voltage
        6. 8.2.2.6  Step Six: Choose the Soft-Start Capacitor
        7. 8.2.2.7  Step Seven: Select the Bootstrap Capacitor
        8. 8.2.2.8  Step Eight: Undervoltage Lockout Threshold
        9. 8.2.2.9  Step Nine: Select Output Voltage and Feedback Resistors
          1. 8.2.2.9.1 Output Voltage Limitations
        10. 8.2.2.10 Step 10: Select Loop Compensation Components
        11. 8.2.2.11 Power Dissipation Estimate
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Development Support
        1. 11.1.1.1 Custom Design With WEBENCH® Tools
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Support Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.4 Thermal Information(2)

THERMAL METRIC(1) TPS54218 UNIT
RTE (WQFN)
16 PINS
RθJA Junction-to-ambient thermal resistance 50 °C/W
RθJA Junction-to-ambient thermal resistance (3) 37 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 59.1 °C/W
RθJB Junction-to-board thermal resistance 23.1 °C/W
ψJT Junction-to-top characterization parameter 1.4 °C/W
ψJB Junction-to-board characterization parameter 23.1 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 7.9 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.
(2) Unless otherwise specified, metrics listed in this table refer to JEDEC high-K board measurements
(3) Test Board Conditions:
  • 2 inches × 2 inches, 4 layers, thickness: 0.062 inch
  • 2 oz. copper traces located on the top of the PCB
  • 2 oz. copper ground planes located on the two internal layers and bottom layer
  • 4 thermal vias (10 mil) located under the device package