SLVSA86D March   2010  – October 2018 TPS54260

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
    1.     Device Images
      1.      Simplified Schematic
      2.      Efficiency vs Load Current
  4. Revision History
  5. Pin Configuration and Functions
    1.     Pin Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Fixed Frequency PWM Control
      2. 7.3.2  Slope Compensation Output Current
      3. 7.3.3  Pulse-Skip Eco-Mode
      4. 7.3.4  Low-Dropout Operation and Bootstrap Voltage (BOOT)
      5. 7.3.5  Error Amplifier
      6. 7.3.6  Voltage Reference
      7. 7.3.7  Adjusting the Output Voltage
      8. 7.3.8  Enable and Adjusting Undervoltage Lockout
      9. 7.3.9  Slow-Start / Tracking Pin (SS/TR)
      10. 7.3.10 Overload Recovery Circuit
      11. 7.3.11 Sequencing
      12. 7.3.12 Constant Switching Frequency and Timing Resistor (RT/CLK Pin)
      13. 7.3.13 Overcurrent Protection and Frequency Shift
      14. 7.3.14 Selecting the Switching Frequency
      15. 7.3.15 How to Interface to RT/CLK Pin
      16. 7.3.16 Powergood (PWRGD Pin)
      17. 7.3.17 Overvoltage Transient Protection
      18. 7.3.18 Thermal Shutdown
      19. 7.3.19 Small Signal Model for Loop Response
      20. 7.3.20 Simple Small Signal Model for Peak Current Mode Control
      21. 7.3.21 Small Signal Model for Frequency Compensation
    4. 7.4 Device Functional Modes
      1. 7.4.1 Operation Near Minimum Input Voltage
      2. 7.4.2 Operation With Enable Control
  8. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 3.3-V Output Application
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1  Custom Design With WEBENCH® Tools
          2. 8.2.1.2.2  Selecting the Switching Frequency
          3. 8.2.1.2.3  Output Inductor Selection (LO)
          4. 8.2.1.2.4  Output Capacitor
          5. 8.2.1.2.5  Catch Diode
          6. 8.2.1.2.6  Input Capacitor
          7. 8.2.1.2.7  Slow-Start Capacitor
          8. 8.2.1.2.8  Bootstrap Capacitor Selection
          9. 8.2.1.2.9  Undervoltage Lock Out Set Point
          10. 8.2.1.2.10 Output Voltage and Feedback Resistors Selection
          11. 8.2.1.2.11 Compensation
          12. 8.2.1.2.12 Discontinuous Mode and Eco-Mode Boundary
          13. 8.2.1.2.13 Power Dissipation Estimate
        3. 8.2.1.3 Application Curves
      2. 8.2.2 Inverting Power Supply
      3. 8.2.3 Split-Rail Power Supply
      4. 8.2.4 12-V to 3.8-V GSM Power Supply
      5. 8.2.5 24-V to 4.2-V GSM Power Supply
  9. Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
      2. 11.1.2 Development Support
        1. 11.1.2.1 Custom Design With WEBENCH® Tools
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Community Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Revision History

Changes from C Revision (May 2016) to D Revision

  • Added top navigator icon for TI reference designGo
  • Added links for WEBENCH Go
  • Changed the minimum value for PH, 10-ns transient from –2 V to –5 VGo

Changes from B Revision (December 2014) to C Revision

Changes from A Revision (December 2010) to B Revision

  • Added Pin Configuration and Functions section, ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section Go
  • Simplified front page schematic for clarityGo
  • Deleted Junction-to-ambient thermal resistance (custom board) from Thermal InformationGo
  • Added "the level set" to Fixed Frequency PWM Control descriptionGo

Changes from * Revision (March 2010) to A Revision

  • Added 10-Pin 3mm × 3mm SON to Features and DescriptionGo
  • Added SON package Go
  • Added DRC thermal data to thermal table and deleted dissipation rating tableGo