SNVSB93 December   2018 TPS54360B

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Simplified Schematic
      2.      Efficiency vs Load Current
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Fixed Frequency PWM Control
      2. 7.3.2  Slope Compensation Output Current
      3. 7.3.3  Pulse Skip Eco-mode
      4. 7.3.4  Low Dropout Operation and Bootstrap Voltage (BOOT)
      5. 7.3.5  Error Amplifier
      6. 7.3.6  Adjusting the Output Voltage
      7. 7.3.7  Enable and Adjusting Undervoltage Lockout
      8. 7.3.8  Internal Soft Start
      9. 7.3.9  Constant Switching Frequency and Timing Resistor (RT/CLK) pin)
      10. 7.3.10 Accurate Current Limit Operation and Maximum Switching Frequency
      11. 7.3.11 Synchronization to RT/CLK pin
      12. 7.3.12 Overvoltage Protection
      13. 7.3.13 Thermal Shutdown
      14. 7.3.14 Small Signal Model for Loop Response
      15. 7.3.15 Simple Small Signal Model for Peak-Current-Mode Control
      16. 7.3.16 Small Signal Model for Frequency Compensation
    4. 7.4 Device Functional Modes
      1. 7.4.1 Operation with VIN ≤ 4.5 V (Minimum VIN)
      2. 7.4.2 Operation with EN Control
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1  Custom Design with WEBENCH® Tools
        2. 8.2.2.2  Selecting the Switching Frequency
        3. 8.2.2.3  Output Inductor Selection (LO)
        4. 8.2.2.4  Output Capacitor
        5. 8.2.2.5  Catch Diode
        6. 8.2.2.6  Input Capacitor
        7. 8.2.2.7  Bootstrap Capacitor Selection
        8. 8.2.2.8  Undervoltage Lockout Set Point
        9. 8.2.2.9  Output Voltage and Feedback Resistors Selection
        10. 8.2.2.10 Minimum VIN
        11. 8.2.2.11 Compensation
        12. 8.2.2.12 Discontinuous Conduction Mode and Eco-mode Boundary
        13. 8.2.2.13 Power Dissipation Estimate
      3. 8.2.3 Application Curves
    3. 8.3 Other Applications
      1. 8.3.1 Inverting Power
      2. 8.3.2 Split-Rail Power Supply
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
      1. 10.2.1 Estimated Circuit Area
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
      2. 11.1.2 Custom Design with WEBENCH® Tools
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Community Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.2 ESD Ratings

MAX UNIT
VESD(1) Human body model (HBM) esd stress voltage (2) ±2000 V
Charged device model (HBM) ESD stress voltage (3) ±500
(1) Electrostatic discharge (ESD) to measure device sensitivity and immunity to damage caused by assembly line electrostatic discharges into the device.
(2) Level listed above is the passing level per ANSI/ESDA/JEDEC JS-001. JEDEC document JEP155 states that 500V HBM allows safe manufacturing with a standard ESD control process. pins listed as 1000 V may actually have higher performance.
(3) Level listed above is the passing level per EIA-JEDEC JESD22-C101. JEDEC document JEP157 states that 250V CDM allows safe manufacturing with a standard ESD control process. pins listed as 250 V may actually have higher performance.