SLVSGM2 March   2023 TPS548C26

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Internal VCC LDO and Using an External Bias on VCC and VDRV Pin
      2. 7.3.2  Input Undervoltage Lockout (UVLO)
        1. 7.3.2.1 Fixed VCC_OK UVLO
        2. 7.3.2.2 Fixed VDRV UVLO
        3. 7.3.2.3 Fixed PVIN UVLO
        4. 7.3.2.4 Enable
      3. 7.3.3  Set the Output Voltage
      4. 7.3.4  Differential Remote Sense and Feedback Divider
      5. 7.3.5  Start-up and Shutdown
      6. 7.3.6  Loop Compensation
      7. 7.3.7  Set Switching Frequency and Operation Mode
      8. 7.3.8  Switching Node (SW)
      9. 7.3.9  Overcurrent Limit and Low-side Current Sense
      10. 7.3.10 Negative Overcurrent Limit
      11. 7.3.11 Zero-Crossing Detection
      12. 7.3.12 Input Overvoltage Protection
      13. 7.3.13 Output Undervoltage and Overvoltage Protection
      14. 7.3.14 Overtemperature Protection
      15. 7.3.15 Power Good
    4. 7.4 Device Functional Modes
      1. 7.4.1 Forced Continuous-Conduction Mode
      2. 7.4.2 Auto-Skip Eco-mode Light Load Operation
      3. 7.4.3 Powering the Device from a 12-V Bus
      4. 7.4.4 Powering the Device From a Split-rail Configuration
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Application
      2. 8.2.2 Design Requirements
      3. 8.2.3 Detailed Design Procedure
        1. 8.2.3.1 Inductor Selection
        2. 8.2.3.2 Input Capacitor Selection
        3. 8.2.3.3 Output Capacitor Selection
        4. 8.2.3.4 VCC and VRDV Bypass Capacitor
        5. 8.2.3.5 BOOT Capacitor Selection
        6. 8.2.3.6 PG Pullup Resistor Selection
      4. 8.2.4 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
        1. 8.4.2.1 Thermal Performance on TPS548C26 Evaluation Board
  9. 9 Device and Documentation Support
    1. 9.1 Receiving Notification of Documentation Updates
    2. 9.2 Support Resources
    3. 9.3 Trademarks
    4. 9.4 Electrostatic Discharge Caution
    5. 9.5 Glossary
  10. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.3.8 Switching Node (SW)

The SW pins connect to the switching node of the power conversion stage. The SW pins act as the return path for the high-side gate driver. During nominal operation, the voltage swing on SW normally traverses from below ground to above the input voltage. Parasitic inductance in the PVIN to PGND loop (including the component from the PCB layout and also the component inside the package) and the output capacitance (COSS) of both power FETs form a resonant circuit that can produce high frequency (> 100 MHz) ringing on this node. The voltage peak of this ringing, if not controlled, can be significantly higher than the input voltage. TPS548C26 high-side gate driver is fine tuned to minimize the peak ringing amplitude so that a RC snubber on SW node is usually not needed. However, TI highly recommends for the user to measure the voltage stress across either the high-side or low-side FET and ensure that the peak ringing amplitude does not exceed the absolute maximum rating limit listed in the Absolute Maximum Ratings table.