SLVSHH9 February   2024 TPS54KC23

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1  Internal VCC LDO and Using External Bias On the VCC Pin
      2. 6.3.2  Enable
      3. 6.3.3  Adjustable Soft Start
      4. 6.3.4  Power Good
      5. 6.3.5  Output Voltage Setting
      6. 6.3.6  Remote Sense
      7. 6.3.7  D-CAP4 Control
      8. 6.3.8  Multifunction Select (MSEL) Pin
      9. 6.3.9  Low-side MOSFET Zero-Crossing
      10. 6.3.10 Current Sense and Positive Overcurrent Protection
      11. 6.3.11 Low-side MOSFET Negative Current Limit
      12. 6.3.12 Overvoltage and Undervoltage Protection
      13. 6.3.13 Output Voltage Discharge
      14. 6.3.14 UVLO Protection
      15. 6.3.15 Thermal Shutdown
    4. 6.4 Device Functional Modes
      1. 6.4.1 Auto-Skip Eco-mode Light Load Operation
      2. 6.4.2 Forced Continuous-Conduction Mode
      3. 6.4.3 Powering the Device From a Single Bus
      4. 6.4.4 Powering the Device From a Split-rail Configuration
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
        1. 7.2.2.1  Output Voltage Setting Point
        2. 7.2.2.2  Choose the Switching Frequency and the Operation Mode
        3. 7.2.2.3  Choose the Inductor
        4. 7.2.2.4  Set the Current Limit (ILIM)
        5. 7.2.2.5  Choose the Output Capacitor
        6. 7.2.2.6  RAMP Selection
        7. 7.2.2.7  Choose the Input Capacitors (CIN)
        8. 7.2.2.8  Soft-Start Capacitor (SS Pin)
        9. 7.2.2.9  EN Pin Resistor Divider
        10. 7.2.2.10 VCC Bypass Capacitor
        11. 7.2.2.11 BOOT Capacitor
        12. 7.2.2.12 RC Snubber
        13. 7.2.2.13 PG Pullup Resistor
      3. 7.2.3 Application Curves
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Documentation Support
      1. 8.1.1 Related Documentation
    2. 8.2 Receiving Notification of Documentation Updates
    3. 8.3 Support Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.4 Thermal Information

THERMAL METRIC(1) TPS54KC23 UNIT
RZR (WQFN-FCRLF, JEDEC layout) RZR (WQFN-FCRLF, 4-layer application layout) RZR (WQFN-FCRLF, 6-layer EVM layout)
16 PINS 16 PINS 16 PINS
RθJA Junction-to-ambient thermal resistance 36.8 16.5 (2) 13.2 (3) °C/W
RθJC(top) Junction-to-case (top) thermal resistance 15.3 Not applicable (4) Not applicable (4) °C/W
RθJB Junction-to-board thermal resistance 7.6 Not applicable (4) Not applicable (4) °C/W
ψJT Junction-to-top characterization parameter 0.3 Not applicable (4) Not applicable (4) °C/W
ψJB Junction-to-board characterization parameter 7.5 Not applicable (4) Not applicable (4) °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 5.1 Not applicable (4) Not applicable (4) °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.
(2) Measured on 4 layer, 2 oz copper, 3 inch × 3 inch layout with the device not switching and 1.9W dissipated in the device.
(3) Measured on U2 device on EVM with the device not switching and 1.8W dissipated in the device.
(4) The thermal test or simulation setup is not applicable to an application layout.