SLVS939B June   2009  – December 2014 TPS55332-Q1

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Input Voltage (VIN)
      2. 7.3.2  Output Voltage (Vout)
      3. 7.3.3  Regulated Supply Voltage (VReg)
      4. 7.3.4  Over-Current Protection (SW)
      5. 7.3.5  Oscillator Frequency (RT)
      6. 7.3.6  Enable / Shutdown (EN)
      7. 7.3.7  Reset Delay (Cdly)
      8. 7.3.8  Reset Pin (RST)
      9. 7.3.9  Boost Capacitor (BOOT)
      10. 7.3.10 Soft Start (SS)
      11. 7.3.11 Synchronization (SYNC)
      12. 7.3.12 Regulation Voltage (VSENSE)
      13. 7.3.13 Reset Threshold (RST_TH)
      14. 7.3.14 Slew Rate Control (Rslew)
      15. 7.3.15 Thermal Shutdown
      16. 7.3.16 Loop Control Frequency Compensation
    4. 7.4 Device Functional Modes
      1. 7.4.1 DCM Operation
      2. 7.4.2 CCM Operation
      3. 7.4.3 Loop Compensation For Stability Criteria
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1  Output Capacitor (Co)
        2. 8.2.2.2  Output Inductor Selection (Lo) for CCM
        3. 8.2.2.3  Output Diode
        4. 8.2.2.4  Input Capacitor CI
        5. 8.2.2.5  Output Voltage And Feedback Resistor Selection
        6. 8.2.2.6  Reset Threshold Resistor Selection
        7. 8.2.2.7  Soft Start Capacitor
        8. 8.2.2.8  Loop Compensation Calculation
        9. 8.2.2.9  Loop Compensation Response
        10. 8.2.2.10 Output Inductor Selection (LO) For DCM
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Inductor
      2. 10.1.2 Input Filter Capacitors
      3. 10.1.3 Feedback
      4. 10.1.4 Traces And Ground Plane
    2. 10.2 Layout Example
    3. 10.3 Power Dissipation
  11. 11Device and Documentation Support
    1. 11.1 Trademarks
    2. 11.2 Electrostatic Discharge Caution
    3. 11.3 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

11 Device and Documentation Support

11.1 Trademarks

PowerPAD is a trademark of Texas Instruments.

All other trademarks are the property of their respective owners.

11.2 Electrostatic Discharge Caution

esds-image

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.

11.3 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.