SLUSEN2 April   2022 TPS564242 , TPS564247

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 PWM Operation and D-CAP3 Control
      2. 7.3.2 Eco-Mode Control
      3. 7.3.3 Soft Start and Prebiased Soft Start
      4. 7.3.4 Overvoltage Protection
      5. 7.3.5 Large Duty Operation
      6. 7.3.6 Current Protection and Undervoltage Protection
      7. 7.3.7 Undervoltage Lockout (UVLO) Protection
      8. 7.3.8 Thermal Shutdown
    4. 7.4 Device Functional Modes
      1. 7.4.1 Eco-Mode Operation
      2. 7.4.2 FCCM Mode Control
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Custom Design With WEBENCH® Tools
        2. 8.2.2.2 Output Voltage Resistors Selection
        3. 8.2.2.3 Output Filter Selection
        4. 8.2.2.4 Input Capacitor Selection
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
      2. 11.1.2 Development Support
        1. 11.1.2.1 Custom Design With WEBENCH® Tools
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Support Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.4 Thermal Information

THERMAL METRIC(1) DRL (SOT-563) UNIT
6 PINS
RθJA Junction-to-ambient thermal resistance 131.1 °C/W
RθJA_effective (2)  Junction-to-ambient thermal resistance on EVM board 58 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 45.6 °C/W
RθJB Junction-to-board thermal resistance 16.4 °C/W
ΨJT Junction-to-top characterization parameter 0.8 °C/W
YJB Junction-to-board characterization parameter 16.1 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance N/A °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.
(2) This RθJA_effective is tested on TPS564242EVM board (2 layer, copper thickness of top and bottom layer are 2 oz) at VIN = 12 V, VOUT = 5 V, IOUT = 4 A , TA = 25oC.