SLUSF02
November 2023
TPS568236
PRODUCTION DATA
1
1
Features
2
Applications
3
Description
4
Pin Configuration and Functions
5
Specifications
5.1
Absolute Maximum Ratings
5.2
ESD Ratings
5.3
Recommended Operating Conditions
5.4
Thermal Information
5.5
Electrical Characteristics
5.6
Typical Characteristics
6
Detailed Description
6.1
Overview
6.2
Functional Block Diagram
6.3
Feature Description
6.3.1
PWM Operation and D-CAP3 Control Mode
6.3.2
VCC LDO
6.3.3
Soft Start
6.3.4
Enable Control
6.3.5
Power Good
6.3.6
Overcurrent Protection and Undervoltage Protection
6.3.7
UVLO Protection
6.3.8
Overvoltage Protection
6.3.9
Output Voltage Discharge
6.3.10
Thermal Shutdown
6.4
Device Functional Modes
6.4.1
MODE Pin
6.4.2
Forced Continuous Conduction Operation
6.4.3
Power Save Mode (PSM)
7
Application and Implementation
7.1
Application Information
7.2
Typical Application
7.2.1
Design Requirements
7.2.2
Detailed Design Procedure
7.2.2.1
External Component Selection
7.2.2.1.1
Inductor Selection
7.2.2.1.2
Output Capacitor Selection
7.2.2.1.3
Input Capacitor Selection
7.2.3
Application Curves
7.3
Power Supply Recommendations
7.4
Layout
7.4.1
Layout Guidelines
7.4.2
Layout Example
8
Device and Documentation Support
8.1
Device Support
8.1.1
Third-Party Products Disclaimer
8.2
Receiving Notification of Documentation Updates
8.3
Support Resources
8.4
Trademarks
8.5
Electrostatic Discharge Caution
8.6
Glossary
9
Revision History
10
Mechanical, Packaging, and Orderable Information
Package Options
Mechanical Data (Package|Pins)
RJN|12
MPSS141
Thermal pad, mechanical data (Package|Pins)
Orderable Information
slusf02_oa
slusf02_pm
7.4.1
Layout Guidelines
Use a four-layer PCB for good thermal performance and with maximum ground plane.
Have a small bypass capacitor on VIN side of the IC. Place the capacitor as close to IC as possible.
Route FB and VOUT traces away from the noisy switch node.
Make VIN and VOUT traces wide to reduce the trace impedance.