SLVS888C December   2008  – October 2015 TPS60150

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Enable
      2. 7.3.2 Undervoltage Lockout
      3. 7.3.3 Thermal Shutdown Protection
    4. 7.4 Device Functional Modes
      1. 7.4.1 Soft Start
      2. 7.4.2 Normal Mode and Skip Mode Operation
      3. 7.4.3 Short Circuit Protection
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 USB On the Go Circuitry
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 Capacitor Selection
        3. 8.2.1.3 Application Curves
      2. 8.2.2 System Example
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Community Resources
    2. 11.2 Trademarks
    3. 11.3 Electrostatic Discharge Caution
    4. 11.4 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6 Specifications

6.1 Absolute Maximum Ratings

Over operating free-air temperature range (unless otherwise noted) (1)
MIN MAX UNIT
VIN Input voltage (all pins) –0.3 7 V
TA Operating temperature –40 85 °C
TJ Maximum operating junction temperature 150 °C
Tstg Storage temperature –55 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

6.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)(2) ±2000 V
Charged-device model (CDM), per JEDEC specification JESD22-C101(3) ±500
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) The human body model (HBM) is a 100-pF capacitor discharged through a 1.5-kΩ resistor into each pin. The testing is done according JEDECs EIA/JESD22-A114.
(3) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

MIN NOM MAX UNIT
VIN Input voltage 2.7 5.5 V
TA Operating ambient temperature –40 85 °C
TJ Operating junction temperature –40 125 °C
Cin Input capacitor 2.2 μF
Co Output capacitor 2.2 μF
Cf Flying capacitor 1 μF

6.4 Thermal Information

THERMAL METRIC(1) TPS60150 UNIT
DRV (WSON)
6 PINS
RθJA Junction-to-ambient thermal resistance 69.1 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 79.8 °C/W
RθJB Junction-to-board thermal resistance 38.6 °C/W
ψJT Junction-to-top characterization parameter 1.2 °C/W
ψJB Junction-to-board characterization parameter 38.4 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 9.2 °C/W
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

6.5 Electrical Characteristics

VIN = 3.6 V, TA = –40°C to 85°C, typical values are at TA = 25°C, C1 = C3 = 2.2 μF, C2 = 1 μF (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
POWER STAGE
VIN Input voltage range 2.7 5.5 V
VUVLO Undervoltage lockout threshold 1.9 2.1 V
IQ Operating quiescent current IOUT = 140 mA, Enable = VIN 4.7 mA
IQskip Skip mode operating quiescent current IOUT = 0 mA, Enable=VIN (no switching) 80 μA
IOUT = 0 mA, Enable = VIN(minimum switching) 90 μA
ISD Shut down current 2.7 V ≤ VIN ≤ 5.5 V, Enable = 0 V 1 μA
VOUT Output voltage(1) IOUT ≤ 50 mA, 2.7 V ≤ VIN < 5.5 V 4.8 5 5.2 V
VOUT(skip) Skip mode output voltage IOUT = 0 mA, 2.7 V ≤ VIN ≤ 5.5 V VOUT + 0.1 V
FSW Switching frequency 1.5 MHz
SSTIME Soft-start time From the rising edge of enable to 90% output 150 μs
OUTPUT CURRENT
IOUT_nom Maximum output current VOUT remains from 4.8 V to 5.2 V,
3.1 V ≤ VIN ≤ 5.5 V		 120 mA
3.3 V < VIN < 5.5 V 140
IOUT_short Short circuit current(2) VOUT = 0 V 80 mA
RIPPLE VOLTAGE
VR Output ripple voltage IOUT = 140 mA 30 mV
ENABLE CONTROL
VHI Logic high input voltage 2.7 V ≤ VIN ≤ 5.5 V 1.3 VIN V
VLI Logic low input voltage –0.2 0.4 V
IHI Logic high input current 1 μA
ILI Logic low input current 1 μA
THERMAL SHUTDOWN
TSD Shutdown temperature 160 °C
TRC Shutdown recovery 140 °C
(1) When in skip mode, output voltage can exceed VOUT spec because VOUT(skip) = VOUT+0.1.
(2) The TPS60150 device has internal protection circuit to protect IC when VOUT shorted to GND.

6.6 Typical Characteristics

TPS60150 qui_curr_lvs888.gif
Figure 1. Quiescent Current vs Input Voltage
TPS60150 io_vi_lvs888.gif
Figure 2. Maximum Output Current vs Input Voltage at Temperature