SLVSF14B September   2019  – August 2020 TPS61023

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Undervoltage Lockout
      2. 7.3.2 Enable and Soft Start
      3. 7.3.3 Switching Frequency
      4. 7.3.4 Current Limit Operation
      5. 7.3.5 Pass-Through Operation
      6. 7.3.6 Overvoltage Protection
      7. 7.3.7 Output Short-to-Ground Protection
      8. 7.3.8 Thermal Shutdown
    4. 7.4 Device Functional Modes
      1. 7.4.1 PWM Mode
      2. 7.4.2 Power-Save Mode
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Setting the Output Voltage
        2. 8.2.2.2 Inductor Selection
        3. 8.2.2.3 Output Capacitor Selection
        4. 8.2.2.4 Loop Stability, Feedforward Capacitor Selection
        5. 8.2.2.5 Input Capacitor Selection
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
    3. 10.3 Thermal Considerations
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Support Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information
    1. 12.1 Package Option Addendum
    2. 12.2 Tape and Reel Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)

6.4 Thermal Information

THERMAL METRIC(1)TPS61023TPS61023UNIT
DRL (SOT563) - 6 PINSDRL (SOT563) - 6 PINS
StandardEVM(2)
RθJAJunction-to-ambient thermal resistance142.791.4°C/W
RθJCJunction-to-case thermal resistance55.7N/A°C/W
RθJBJunction-to-board thermal resistance31.0N/A°C/W
ΨJTJunction-to-top characterization parameter1.45.3°C/W
ΨJBJunction-to-board characterization parameter30.738.1°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.
(2) Measured on TPS61023EVM, 4-layer, 2oz copper 50mm×38mm PCB.