SLVSGI6D october   2022  – september 2023 TPS61033 , TPS610333

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison Table
  6. 5 Revision History
  7. 6 Pin Configuration and Functions
  8. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Typical Characteristics
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  Undervoltage Lockout
      2. 8.3.2  Enable and Soft Start
      3. 8.3.3  Setting the Output Voltage
      4. 8.3.4  Current Limit Operation
      5. 8.3.5  Pass-Through Operation
      6. 8.3.6  Power Good Indicator
      7. 8.3.7  Implement Output Discharge by PG function
      8. 8.3.8  Overvoltage Protection
      9. 8.3.9  Output Short-to-Ground Protection
      10. 8.3.10 Thermal Shutdown
    4. 8.4 Device Functional Modes
      1. 8.4.1 PWM Mode
      2. 8.4.2 Power-Save Mode
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Setting the Output Voltage
        2. 9.2.2.2 Inductor Selection
        3. 9.2.2.3 Output Capacitor Selection
        4. 9.2.2.4 Input Capacitor Selection
      3. 9.2.3 Application Curves
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
      3. 9.4.3 Thermal Considerations
  11. 10Device and Documentation Support
    1. 10.1 Device Support
      1. 10.1.1 Third-Party Products Disclaimer
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.4 Thermal Information

THERMAL METRIC(1) TPS61033 TPS61033 UNIT
DRL (SOT583)- 8 PINS DRL (SOT583)- 8 PINS
Standard EVM(2)
RθJA Junction-to-ambient thermal resistance 117.5 65.8 °C/W
RθJC Junction-to-case thermal resistance 40.0 NA °C/W
RθJB Junction-to-board thermal resistance 23.0 NA °C/W
ΨJT Junction-to-top characterization parameter 2.8 1.0 °C/W
ΨJB Junction-to-board characterization parameter 22.9 28.4 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.
(2) Measured on TPS61033EVM, 4-layer, 2oz copper NA PCB.