SLVSCO6 January   2015 TPS61093-Q1

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Simplified Schematic
  5. 5 Revision History
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements
    7. 7.7 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Shutdown And Load Discharge
      2. 8.3.2 Over Load And Over Voltage Protection
      3. 8.3.3 Under Voltage Lockout (UVLO)
      4. 8.3.4 Thermal Shutdown
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 15V Output Boost Converter
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
          1. 9.2.1.2.1 Output Program
          2. 9.2.1.2.2 Without Isolation FET
          3. 9.2.1.2.3 Start Up
          4. 9.2.1.2.4 Switch Duty Cycle
          5. 9.2.1.2.5 Inductor Selection
          6. 9.2.1.2.6 Input And Output Capacitor Selection
          7. 9.2.1.2.7 Small Signal Stability
        3. 9.2.1.3 Application Curves
      2. 9.2.2 10 V, -10 V Dual Output Boost Converter
        1. 9.2.2.1 Design Requirements
        2. 9.2.2.2 Detailed Design Procedure
        3. 9.2.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
    3. 11.3 Thermal Considerations
  12. 12Device and Documentation Support
    1. 12.1 Trademarks
    2. 12.2 Electrostatic Discharge Caution
    3. 12.3 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7 Specifications

7.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)
MIN MAX UNIT
Supply voltage on pin VIN(2) –0.3 7 V
Voltage on pins CP2, EN, and SS(2) –0.3 7 V
Voltage on pin CP1 and FB(2) –0.3 3 V
Voltage on pin SW, VO, and OUT(2) –0.3 20 V
Operating Junction Temperature Range -40 150 °C
Tstg, Storage temperature range -55 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltage values are with respect to network ground terminal.

7.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human body model (HBM), per AEC Q100-002(1) ±2000 V
Charged device model (CDM),
per AEC Q100-011 		Corner pins (1, 5, 6, and 10) ±750
Other pins ±500
(1) AEC Q100-002 indicates HBM stressing is done in accordance with the ANSI/ESDA/JEDEC JS-001 specification.

7.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)
MIN NOM MAX UNIT
Vi Input voltage range 1.6 6 V
Vo Output voltage range at VO pin 17 V
L Inductor(1) 2.2 4.7 10 μH
Cin Input capacitor 4.7 μF
Co Output capacitor at OUT pin(1) 1 10 μF
Cfly Flying capacitor at CP1 and CP2 pins 10 nF
TJ Operating junction temperature –40 125 °C
TA Operating ambient temperature –40 125 °C
(1) These values are recommended values that have been successfully tested in several applications. Other values may be acceptable in other applications but should be fully tested by the user.

7.4 Thermal Information

THERMAL METRIC(1) TPS60193-Q1 UNIT
DSK
10 PINS
RθJA Junction-to-ambient thermal resistance 49.2 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 63.3
RθJB Junction-to-board thermal resistance 23.4
ψJT Junction-to-top characterization parameter 1.1
ψJB Junction-to-board characterization parameter 23.0
RθJC(bot) Junction-to-case (bottom) thermal resistance 5.7
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

7.5 Electrical Characteristics

VIN = 3.6 V, EN = VIN, TA = TJ = –40°C to 125°C, typical values are at TA = 25°C (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
SUPPLY CURRENT
VIN Input voltage range, VIN 1.6 6 V
IQ Operating quiescent current into VIN Device PWM switching no load 0.9 1.5 mA
ISD Shutdown current EN = GND, VIN = 6 V 5 μA
UVLO Undervoltage lockout threshold VIN falling 1.5 1.55 V
Vhys Undervoltage lockout hysterisis 50 mV
ENABLE AND PWM CONTROL
VENH EN logic high voltage VIN = 1.6 V to 6 V 1.2 V
VENL EN logic low voltage VIN = 1.6 V to 6 V 0.3 V
REN EN pull down resistor 400 800 1600 kΩ
VOLTAGE CONTROL
VREF Voltage feedback regulation voltage 0.49 0.5 0.51 V
IFB Voltage feedback input bias current 100 nA
fS Oscillator frequency 1.0 1.2 1.4 MHz
Dmax Maximum duty cycle VFB = 0.1 V 90% 93%
POWER SWITCH, ISOLATION FET
RDS(ON)N N-channel MOSFET on-resistance VIN = 3 V 0.25 0.4 Ω
RDS(ON)iso Isolation FET on-resistance VO = 5 V 2.5 4 Ω
VO = 3.5 V 4.5
ILN_N N-channel leakage current VDS = 20 V 3 μA
ILN_iso Isolation FET leakage current VDS = 20 V 1 μA
VF Power diode forward voltage Current = 500 mA 0.8 V
OC, ILIM, OVP SC AND SS
ILIM N-Channel MOSFET current limit 0.9 1.1 1.6 A
Vovp Over voltage protection threshold Measured on the VO pin 18 19 V
Vovp_hys Over voltage protection hysteresis 0.6 V
IOL Over load protection 200 300 mA
THERMAL SHUTDOWN
Tshutdown Thermal shutdown threshold 150 °C
Thysteresis Thermal shutdown hysteresis 15 °C

7.6 Timing Requirements

VIN = 3.6 V, EN = VIN, TA = TJ = –40°C to 125°C, typical values are at TA = 25°C (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
Toff EN pulse width to shutdown EN high to low 1 ms
Tmin_on Minimum on pulse width 65 ns

7.7 Typical Characteristics

Table 1. Table Of Graphs

Figure 1, L = TOKO #A915_Y-100M, unless otherwise noted FIGURE
η Efficiency vs Load current at OUT = 15 V Figure 1
η Efficiency vs Load current at OUT = 10 V Figure 2
VFB FB voltage vs Free-air temperature Figure 3
VFB FB voltage vs Input voltage Figure 4
ILIM Switch current limit vs Free-air temperature Figure 5
Line transient response VIN = 3.3 V to 3.6 V; Load = 50 mA Figure 10
Load transient response VIN = 2.5 V; Load = 10 mA to 50 mA; Cff = 100 pF Figure 11
PWM control in CCM VIN = 3.6 V; Load = 50 mA Figure 12
PWM control in DCM VIN = 3.6 V; Load = 1 mA Figure 13
Pulse skip mode VIN = 4.5 V; OUT = 10 V; No load Figure 14
Soft start-up VIN = 3.6 V; Load = 50 mA Figure 15
TPS61093-Q1 eff2_ld_lvs992.gif
OUT = 15V
Figure 1. Efficiency vs. Load
TPS61093-Q1 vfb_ta_lvs992.gifFigure 3. FB Voltage vs. Free-Air Temperature
TPS61093-Q1 ilim_ta_lvs992.gifFigure 5. Switch Current Limit vs. Free-Air Temperature
TPS61093-Q1 eff3_ld_lvs992.gif
OUT = 10V
Figure 2. Efficiency vs. Load
TPS61093-Q1 fb_vi_lvs992.gifFigure 4. FB Voltage vs. Input Voltage