SLVSDA7E February   2017  – August 2019 TPS61178

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
    1.     Device Images
      1.      Typical Application
  4. Revision History
  5. Device Comparison Table
  6. Pin Configuration and Functions
    1.     Pin Functions
  7. Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements
    7. 7.7 Switching Characteristics
    8. 7.8 Typical Characteristics
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  Under-voltage Lockout
      2. 8.3.2  Enable and Disable
      3. 8.3.3  Startup
      4. 8.3.4  Load Disconnect Gate Driver
      5. 8.3.5  Adjustable Peak Current Limit
      6. 8.3.6  Output Short Protection (with load disconnected FET)
      7. 8.3.7  Adjustable Switching Frequency
      8. 8.3.8  External Clock Synchronization (TPS611781)
      9. 8.3.9  Error Amplifier
      10. 8.3.10 Slope Compensation
      11. 8.3.11 Start-up with the Output Pre-Biased
      12. 8.3.12 Bootstrap Voltage (BST)
      13. 8.3.13 Over-voltage Protection
      14. 8.3.14 Thermal Shutdown
    4. 8.4 Device Functional Modes
      1. 8.4.1 Operation
      2. 8.4.2 Auto PFM Mode (TPS61178)
      3. 8.4.3 Forced PWM Mode (TPS611781)
  9. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Custom Design With WEBENCH® Tools
        2. 9.2.2.2 Setting the Switching Frequency
      3. 9.2.3 Setting the Current Limit
      4. 9.2.4 Setting the Output Voltage
        1. 9.2.4.1 Selecting the Inductor
        2. 9.2.4.2 Selecting the Output Capacitors
        3. 9.2.4.3 Selecting the Input Capacitors
        4. 9.2.4.4 Loop Stability and Compensation
          1. 9.2.4.4.1 Small Signal Model
          2. 9.2.4.4.2 Loop Compensation Design Steps
          3. 9.2.4.4.3 Selecting the Disconnect FET
          4. 9.2.4.4.4 Selecting the Bootstrap Capacitor
          5. 9.2.4.4.5 VCC Capacitor
      5. 9.2.5 TPS61178 Application Waveform
    3. 9.3 System Examples
      1. 9.3.1 TPS61178 with 14-V Output from 2.7-V to 4.4-V Input Voltage
      2. 9.3.2 TPS61178 Without Load Disconnect Function
      3. 9.3.3 TPS611781 External Clock Synchronization
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Third-Party Products Disclaimer
      2. 12.1.2 Development Support
        1. 12.1.2.1 Custom Design With WEBENCH® Tools
    2. 12.2 Documentation Support
      1. 12.2.1 Related Documentation
    3. 12.3 Related Links
    4. 12.4 Receiving Notification of Documentation Updates
    5. 12.5 Community Resources
    6. 12.6 Trademarks
    7. 12.7 Electrostatic Discharge Caution
    8. 12.8 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Layout Guidelines

The basic PCB board layout requires a separation of sensitive signal and power paths. If the layout is not carefully done, the regulator could suffer from the instability or noise problems.

The checklist below is suggested that be followed to get good performance for a well-designed board:

  1. Minimize the high current path including the switch FET, rectifier FET, and the output capacitor. This loop contains high di/dt switching currents ( nano seconds per ampere ) and easy to transduce the high frequency noise;
  2. Minimize the length and area of all traces connected to the SW pin, and always use a ground plane under the switching regulator to minimize inter plane coupling;
  3. Use a combination of bulk capacitors and smaller ceramic capacitors with low series resistance for the input and output capacitors. Place the smaller capacitors closer to the IC to provide a low impedance path for decoupling the noise;
  4. The ground area near the IC must provide adequate heat dissipating area. Connect the wide power bus (e.g., VOUT, SW, GND ) to the large area of copper, or to the bottom or internal layer ground plane, using vias for enhanced thermal dissipation;
  5. Place the input capacitor being close to the VIN pin and the PGND pin in order to reduce the input supply ripple;
  6. Place the noise sensitive network like the feedback and compensation being far away from the SW trace;
  7. Use a separate ground trace to connect the feedback, compensation, frequency set, and the current limit set circuitry. Connect this ground trace to the main power ground at a single point to minimize circulating currents.