SLVSAF7C September   2010  – April 2019 TPS61251

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Simplified Schematic
  4. 4 Revision History
  5. 5 Description (Continued)
  6. 6 Device Options
  7. 7 Pin Configuration and Functions
    1.     Pin Functions
  8. 8 Specifications
    1. 8.1 Absolute Maximum Ratings
    2. 8.2 ESD Ratings
    3. 8.3 Recommended Operating Conditions
    4. 8.4 Thermal Information
    5. 8.5 Electrical Characteristics
    6. 8.6 Typical Characteristics
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Current Limit Operation
      2. 9.3.2 Soft Start
      3. 9.3.3 Enable
      4. 9.3.4 Undervoltage Lockout (UVLO)
      5. 9.3.5 Power Good
      6. 9.3.6 Input Overvoltage Protection
      7. 9.3.7 Load Disconnect and Reverse Current Protection
      8. 9.3.8 Thermal Regulation
      9. 9.3.9 Thermal Shutdown
    4. 9.4 Device Functional Modes
      1. 9.4.1 Power-Save Mode
      2. 9.4.2 Snooze Mode
      3. 9.4.3 100% Duty-Cycle Mode
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
        1. 10.2.2.1 Custom Design With WEBENCH® Tools
        2. 10.2.2.2 Output Voltage Setting
        3. 10.2.2.3 Average Input Current Limit
        4. 10.2.2.4 Maximum Output Current
        5. 10.2.2.5 Inductor Selection
        6. 10.2.2.6 Output Capacitor
        7. 10.2.2.7 Input Capacitor
        8. 10.2.2.8 Checking Loop Stability
      3. 10.2.3 Application Curves
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
    3. 12.3 Thermal Consideration
  13. 13Device and Documentation Support
    1. 13.1 Device Support
      1. 13.1.1 Third-Party Products Disclaimer
    2. 13.2 Development Support
      1. 13.2.1 Custom Design With WEBENCH® Tools
    3. 13.3 Receiving Notification of Documentation Updates
    4. 13.4 Community Resource
    5. 13.5 Trademarks
    6. 13.6 Electrostatic Discharge Caution
    7. 13.7 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8.4 Thermal Information

THERMAL METRIC(1) TPS61251 UNIT
DSG (WSON)
8 PINS
RθJA Junction-to-ambient thermal resistance 80.2 °C/W
RθJCtop Junction-to-case (top) thermal resistance 93.5 °C/W
RθJB Junction-to-board thermal resistance 54.2 °C/W
ψJT Junction-to-top characterization parameter 0.9 °C/W
ψJB Junction-to-board characterization parameter 59.3 °C/W
RθJCbot Junction-to-case (bottom) thermal resistance 20 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.