SLVSGQ1B January   2022  – January 2024 TPS61376

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 VCC Power Supply
      2. 6.3.2 Enable and Programmable UVLO
      3. 6.3.3 Soft Start and Inrush Current Control During Start-Up
      4. 6.3.4 Switching Frequency
      5. 6.3.5 Adjustable input average Current Limit
      6. 6.3.6 Shut Down and Load Disconnect
      7. 6.3.7 Overvoltage Protection
      8. 6.3.8 Output Short Protection
      9. 6.3.9 Thermal Shutdown
    4. 6.4 Device Functional Modes
      1. 6.4.1 PWM Mode
      2. 6.4.2 Auto PFM Mode
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
        1. 7.2.2.1 Setting Output Voltage
        2. 7.2.2.2 Inductor Selection
        3. 7.2.2.3 Bootstrap Capacitor Selection
        4. 7.2.2.4 Input Capacitor Selection
        5. 7.2.2.5 Output Capacitor Selection
        6. 7.2.2.6 Diode Selection
        7. 7.2.2.7 Loop Stability
      3. 7.2.3 Application Curves
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
        1. 7.4.2.1 Thermal Considerations
  9. 8 Device and Documentation Support
    1. 8.1 Device Support
      1. 8.1.1 Third-Party Products Disclaimer
    2. 8.2 Receiving Notification of Documentation Updates
    3. 8.3 Support Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.4 Thermal Information

THERMAL METRIC(1) TPS61376 UNIT
VQFN
13 PINS
RθJA Junction-to-ambient thermal resistance 64.9 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 50.4 °C/W
RθJB Junction-to-board thermal resistance 15.4 °C/W
ψJT Junction-to-top characterization parameter 1.3 °C/W
ψJB Junction-to-board characterization parameter 15.1 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.